Patents Assigned to Pace Micro Technology P1c
  • Heat dissipation in electrical apparatus
    Publication number: 20010008481
    Abstract: The invention relates to the provision of a cooling effect on components (6) of electrical apparatus which are mounted on an upper surface (8) of a printed circuit board (4) within a housing (2). The invention provides for the mounting of a material layer (12) which can absorb or otherwise dissipate heat and the invention allows the mounting of the said material (12) beneath the printed circuit board (4) within the housing (2) in position to provide improved cooling effect without contacting the components (6) themselves.
    Type: Application
    Filed: December 14, 2000
    Publication date: July 19, 2001
    Applicant: Pace Micro Technology P1c
    Inventors: Colin Fuller, Anthony Bristow, Stephen Cross, David Woodhouse, David Sturge