Abstract: The invention relates to the provision of a cooling effect on components (6) of electrical apparatus which are mounted on an upper surface (8) of a printed circuit board (4) within a housing (2). The invention provides for the mounting of a material layer (12) which can absorb or otherwise dissipate heat and the invention allows the mounting of the said material (12) beneath the printed circuit board (4) within the housing (2) in position to provide improved cooling effect without contacting the components (6) themselves.

Abstract: Electrical apparatus comprising a number of components or functions is connected to a control system by a ribbon cable. The ribbon cable includes a first line, which carries a signal or data to control the operation of a first component or function, and at least a second line, which carries a signal or data to control the operation of at least a second component or function. An additional signal or data is injected along the first line from the control system which has the effect of reducing the effect of noise from the signal or data passing along the at least second line, on the signal or data passing along the first line.