Abstract: A downhole electrical feedthrough package and method for making the same. The feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.

Abstract: A system for determining the impact of moisture on a dielectric sealing material may include a testing apparatus having a testing chamber. A dielectric sealing material and a conducting pin may be exposed to the testing chamber. A first electrical lead may be coupled to the conducting pin, and a second electrical lead may be coupled to the dialectic material. An insulation resistance measurement unit may be coupled to both the first electrical lead and the second electrical lead, and the insulation resistance measurement unit may be configured to measure an insulation resistance value between the electrical leads. The insulation resistance measurement unit may measure a first insulation resistance value of the dielectric sealing material in a first environmental condition, and the insulation resistance measurement unit may measure a second insulation resistance value of the dielectric sealing material at a second environmental condition, that is different than the first environmental condition.

Abstract: Methods for manufacturing firearms and firearm components from bonded multi-metallic base materials comprising at least two dissimilar metallic materials having different properties, such as weight, density, wear resistance, durability, hardness, and the like, bonded to one another are provided. The bonded multi-metallic materials may be explosively bonded multi-metallic materials. The methods involve providing a bonded multi-metallic substrate material, cutting the rough shape of a component from the bonded multi-metallic substrate material, and machining the rough component shape to a desired three dimensional configuration of the component.

Abstract: Methods for manufacturing firearms and firearm components from bonded multi-metallic base materials comprising at least two dissimilar metallic materials having different properties, such as weight, density, wear resistance, durability, hardness, and the like, bonded to one another are provided. The bonded multi-metallic materials may be explosively bonded multi-metallic materials.

Abstract: Firearms and firearm components are constructed from bonded multi-metallic base materials comprising at least two dissimilar metallic materials having different properties, such as weight, density, wear resistance, durability, hardness, and the like, bonded to one another. The components are fabricated such that the metallic material having higher impact- and wear-resistance is positioned at areas that experience impact, or that include bearing points, wear points, and interfaces with other components, while a lighter weight metallic material is positioned at component locations that don't have rigorous material property requirements. The bonded multi-metallic materials may be explosively bonded multi-metallic materials.

Abstract: Ceramic inserts and hermetically sealed or sealable connectors incorporating a ceramic insert providing conductive pathways between opposing faces and/or side-walls and fabricated using multi-layer ceramic fabrication techniques are described. Conductive pads provided as metalized surfaces on the ceramic insert facilitate conductive communication between the conductive pathways transiting the ceramic inserts and conductive structures contacting the conductive pads, such as sockets, pins, wires, and the like.

Abstract: Firearms and firearm components are constructed from bonded multi-metallic base materials comprising at least two dissimilar metallic materials having different properties, such as weight, density, wear resistance, durability, hardness, and the like, bonded to one another. The components are fabricated such that the metallic material having higher impact- and wear-resistance is positioned at areas that experience impact, or that include bearing points, wear points, and interfaces with other components, while a lighter weight metallic material is positioned at component locations that don't have rigorous material property requirements. The bonded multi-metallic materials may be explosively bonded multi-metallic materials.

Abstract: Firearms and firearm components are constructed from bonded multi-metallic base materials comprising at least two dissimilar metallic materials having different properties, such as weight, density, wear resistance, durability, hardness, and the like, bonded to one another. The components are fabricated such that the metallic material having higher impact- and wear-resistance is positioned at areas that experience impact, or that include bearing points, wear points, and interfaces with other components, while a lighter weight metallic material is positioned at component locations that don't have rigorous material property requirements. The bonded multi-metallic materials may be explosively bonded multi-metallic materials.

Abstract: Firearms and firearm components are constructed from bonded multi-metallic base materials comprising at least two dissimilar metallic materials having different properties, such as weight, density, wear resistance, durability, hardness, and the like, bonded to one another. The components are fabricated such that the metallic material having higher impact- and wear-resistance is positioned at areas that experience impact, or that include bearing points, wear points, and interfaces with other components, while a lighter weight metallic material is positioned at component locations that don't have rigorous material property requirements. The bonded multi-metallic materials may be explosively bonded multi-metallic materials.

Abstract: EMR-transmissive window assemblies comprising an EMR-transmissive substrate mounted in a substantially rigid framework structure and sealed to the metallic framework structure by means of a ceramic material having a partially amorphous and partially crystalline structure are disclosed. Methods for fabricating EMR-transmissive assemblies are also disclosed.

Abstract: Ceramic inserts and hermetically sealed or sealable connectors incorporating a ceramic insert providing conductive pathways between opposing faces and/or side-walls and fabricated using multi-layer ceramic fabrication techniques are described. Conductive pads provided as metalized surfaces on the ceramic insert facilitate conductive communication between the conductive pathways transiting the ceramic inserts and conductive structures contacting the conductive pads, such as sockets, pins, wires, and the like.

Abstract: Radio frequency (RF) connectors and electronics housings and packages employing one or more inventive RF connector(s) provided herein utilize a ground spring to achieve improved conductivity of the ground signal by making a plurality of contacts with a ferrule member of the RF connector's hermetic feedthru and a plurality of contacts with the electronics housing or package at points adjacent to an air dielectric. Ground springs used in connection with the present RF connectors maintain predetermined spring properties under compression and/or extreme environmental conditions, including thermal fluctuations, and therefore may be suitably employed in aircraft and spacecraft.

Abstract: Radio frequency (RF) connectors and electronics housings and packages employing one or more inventive RF connector(s) provided herein utilize a ground spring to achieve improved conductivity of the ground signal by making a plurality of contacts with a ferrule member of the RF connector's hermetic feedthru and a plurality of contacts with the electronics housing or package at points adjacent to an air dielectric. Ground springs used in connection with the present RF connectors maintain predetermined spring properties under compression and/or extreme environmental conditions, including thermal fluctuations, and therefore may be suitably employed in aircraft and spacecraft.

Abstract: Electronics packages having a primary metallic material, such as a titanium metallic material, metallurgically bonded to one or more secondary regions within the primary metallic material, the composite regions having desirable thermal conductivity properties and having a coefficient of thermal expansion (“CTE”) that generally matches the CTE of the primary metallic material are provided. Electronics packages comprising titanium having heat sinks comprising a metal matrix material such as aluminum silicon carbide or a composite metallic structure such as titanium aluminide/copper, are described. Methods for manufacturing electronics packages having a composite structure are also disclosed.

Abstract: Composite materials are composed of a primary metallic base material, such as a titanium metallic material, metallurgically bonded to one or more secondary materials having desirable thermal conductivity properties and having a coefficient of thermal expansion (“CTE”) that generally matches the CTE of the primary metallic material. An exemplary composite material is composed of a titanium primary material metallurgically bonded to a secondary metal matrix composite material having a high thermal conductivity, such as aluminum silicon carbide. Methods for manufacturing such composite materials are disclosed.

Abstract: A gas discharge lamp controller controls and drives a gas discharge lamp, which may be either a hot cathode lamp or a cold cathode lamp, and may or may not be a fluorescent lamp. The lamp controller separately varies the current and the voltage that are delivered to the lamp to drive it in an illuminated state over a wide range of brightnesses, including very low brightness levels without flicker. The lamp controller includes a brightness control circuit and a driver circuit. A memory circuit stores values for generating arc currents that correspond to a selected brightness and values for generating arc voltages that correspond to the brightness represented by the digital control value. Digital to analog converters convert the arc voltage and arc current values to analog control signals that are delivered to an arc current driver circuit and an arc voltage driver circuit. A photodetector may provide feedback as to the brightness of light generated by the lamp to control different phases of operation (e.g.