Abstract: To provide radio-frequency (RF) bandstop filtering within an implantable lead for use in reducing lead heating during magnetic resonance imaging (MRI) procedures, parallel inductive-capacitive (LC) filters are provided within the lead. In one example, the ring electrode of the lead is configured to function as one of the capacitive elements of the parallel LC filter to help provide LC bandstop filtering along the ring conductor of the lead. In another example, capacitive plates are provided that sandwich an inductor mounted near the tip of the lead to provide parallel LC bandstop filtering along the tip conductor of the lead.

Abstract: An vertically-integrated electronic assembly containing integral passive components is combined with an integrated circuit creating a three-dimensional package. The electronic assembly is formed as a multi-layered structure having deposited passive components on a substrate layer. Contact pads for the passive components extend to an edge of the substrate layer and are exposed for contact with surrounding circuitry and with the combined integrated circuit.