Abstract: An intercommunication system includes one or more modular units utilizing a standards-based audio-over-IP configuration. The modularity of the system provides improved scalability. For instance, a number of audio channels is not limited by physical constraints (e.g. number and type of ports) of a central switch. Accordingly, the addition of audio channels may not require swapping one central switch for a larger switch. Moreover, security applications may be layered onto the standards-based audio-over-IP configuration to implement security requirements often found with intercommunications systems.

Abstract: An intercommunication system includes one or more modular units utilizing a standards-based audio-over-IP configuration. The modularity of the system provides improved scalability. For instance, a number of audio channels is not limited by physical constraints (e.g. number and type of ports) of a central switch. Accordingly, the addition of audio channels may not require swapping one central switch for a larger switch. Moreover, security applications may be layered onto the standards-based audio-over-IP configuration to implement security requirements often found with intercommunications systems.

Abstract: A communication system is provided for distributing communications within the system while maintaining each communication at one of a plurality of different security levels. The system uses internal encryption to encode all data signals with an encryption which is specific to the security level of the particular data signal being encoded. The internal encryption is designed to segregate all data signals in the system and to maintain the segregated data signals compartmentalized while being transferred on data streams within the system via common media.

Abstract: A method of bond quality monitoring wherein a bonding machine is fitted with a touchdown mechanism including a pair of contacts (23, 24), which normally open upon touchdown of a bonding tool (27) raised and lowered by a bond head carriage (13). As the tool (27) is lowered towards a bonding surface (31), the bonding machine's computer (61) performs a test (103) to sense production of a touchdown signal produced by opening of the contacts (23, 24). If touchdown is sensed, the carriage (13) proceeds to an overtravel position. Upon reaching the overtravel position, a second test (108) is performed to confirm touchdown, and energy is then applied to the bond site. During energy application, the logic state of the touchdown mechanism is checked to ensure that the contacts do not close, for example, to check for application of inadequate force during bonding. If a contact closure is sensed, the bond site location is logged for further examination such as a nondestructive pull test.