Abstract: A vacuum pressure furnace and/or a cooling plate for a vacuum pressure furnace is described, having a cooling channel or tube that selectively circulates a liquid coolant at a reduced temperature. The cooling channel “snakes” back and forth through a target plate assembly to conduct heat from the target plate assembly and back to the coolant. The target plate assembly includes a plurality of clamp members that are screwed over portions of the cooling channel and to a bottom of a plate member of the assembly, enclosing portions of the cooling channel. Thermal sheets or foil are wrapped around the cooling channel, thereby bridging any gaps between the components that may occur during temperature changes due to thermal expansion/contraction.

Abstract: A process control procedure for a bonding process includes predetermining a deformation limit and a deforming time limit is for deforming a bonding precursor member. The bonding precursor member is deformed while monitoring instantaneous deformation values and instantaneous deforming time values for the bonding precursor member. A deforming shut-down time value is set at an instantaneous deforming time value corresponding to an occurrence of a first condition or a second condition. The first condition is an instantaneous deformation value for the bonding precursor member reaching the deformation limit and the second condition is an instantaneous deforming time value for the bonding precursor member reaching the deforming time limit. Deformation of the bonding precursor member is shut down at the deforming shut-down time value, thereby producing a deformed bond member from the bonding precursor member.

Abstract: A stage positioning system and method for aligning optical components according to a figure of merit is disclosed. The system includes a stage assembly having six axes of freedom wherein the pivot point of the stage assembly motion is user definable and preferably outside the envelope formed by the stage assembly. The stage assembly includes three sub-assemblies. A base sub-assembly provides x and z axes motion, a yaw stage provides yaw about the y axis, and a three-axis stage provides y motion as well as pitch and roll about the x and z axes, respectively.

Abstract: A method is provided for placement of a first workpiece onto a second workpiece. The first workpiece is initially positioned at an origination location and the second workpiece has an attach location different from the origination location. A first place step is performed to displace the first workpiece from the origination location to an intermediate location different from the origination and attach locations. A second place step is performed to displace the first workpiece from the intermediate location to the attach location and the first workpiece is attached to the second workpiece at the attach location.

Abstract: A method of producing a ball bump on a workpiece employs a capillary having a passageway therethrough. A wire extends through the passageway and has a ball formed on its end below the capillary. The capillary is positioned above a bond site and is lowered until the ball contacts the bond site. The capillary simultaneously applies ultrasonic energy and a downward force against the ball to deform the ball to a ball bump and bond it to the bond site. The capillary is thereafter displaced in a first direction to break the wire away from the ball bump. The capillary is then displaced in a second direction across the ball bump to engage any residual wire protruding from the ball bump surface and substantially smooth the residual wire against the ball bump surface.

Abstract: A bond head is provided for a wire bonding machine having a linear axis frame, a rotary axis frame, a bond tool and a wire clamp. The linear axis frame is vertically linearly displacable along a linear axis, while the rotary axis frame is rotationally displacable along a rotary axis. A pivotal connector is provided which pivotally connects the rotary axis frame to the linear axis frame, enabling the rotary axis frame to rotate independent of linear displacement of the linear axis frame. The bond tool is connected to the rotary axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame and rotationally displacable in response to rotational displacement of the rotary axis frame. The wire clamp is connected to the linear axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame, while the wire clamp is maintained rotationally stationary during rotational displacement of the rotary axis frame.

Abstract: A wire conveyance system is provided for a wire bonding machine having, in series, a first wire handler, a wire slacking device and a second wire handler. The wire slacking device includes a wire support chamber having a substantially enclosed bottom, opposing first and second vertical sidewalls, a substantially open top, a back opening and a front opening. The wire slacking device further includes a pressurized fluid source and first and second fluid orifices for receiving a pressurized fluid from the pressurized fluid source. The fluid orifices extend through the first or second sidewall of the wire support chamber with the second fluid orifice being positioned downstream of the first fluid orifice. First and second fluid paths are provided in fluid communication with the pressurized fluid source via the first and second fluid orifices. The first and second fluid paths extend upward between the first and second sidewalls of the wire support chamber and out the open top.