Abstract: There is provided a method for manufacturing an electronic component package. The method includes (i) providing a package precursor in which an electronic component is embedded such that an electrode of the electronic component is exposed at a surface of a sealing resin layer; (ii) forming a first metal plating layer such that the first metal plating layer is in contact with the exposed surface of the electrode of the electronic component; (iii) disposing a metal foil in face-to-face spaced relationship with respect to the first metal plating layer; and (iv) forming a second metal plating layer, wherein in the step (iv), the second metal plating layer is formed to fill a clearance between the first metal plating layer and the metal foil with the second metal plating layer, and thereby integrating the metal foil, the first metal plating layer and the second metal plating layer with each other.

Abstract: A light radiating portion (11a, 11b, 12, 51, 52) radiates light with wavelength ?1 having predetermined absorptivity for an object (16) and light with wavelength ?2 having smaller absorptivity for the object (16) than the wavelength ?1, to a target, so as to scan in 2-dimensional directions. A light receiving portion (17) receives scattered lights reflected by the target based on light with wavelength ?1 and light with wavelength ?2. A measuring portion (18) generates information used for detection of the object (16) at the target, based on difference between the two scattered lights with wavelength ?1 and wavelength ?2 received by the light receiving portion (17). An output portion (53) outputs whether or not the object is present at the target, by 2-dimensional area information, based on scanning by the light radiating portion (11a, 11b, 12, 51, 52) and information generated by the measuring portion (18).

Abstract: An apparatus management device includes a display unit, an operation unit, a storage unit, a selection unit, and an apparatus control unit. The storage unit stores a correspondence relationship between a user request, an apparatus, and a control condition. The control condition is a condition for the apparatus to be in an operating state appropriate for the user request. The operation unit receives an input operation of the user request. The selection unit selects an apparatus that does not satisfy the control condition from apparatuses that are associated, in the correspondence relationship stored in the storage unit, with the user request accepted by the operation unit. The display unit displays the apparatus selected by the selection unit.

Abstract: The present invention provides a strobe device which includes: a light-emitting unit rotatably coupled to a strobe body unit which is detachably mounted on an imaging apparatus; a variable mechanism capable of varying an angle of orientation of the light-emitting unit with respect to the strobe body unit; a driving unit for driving the variable mechanism; a control section for controlling the driving unit; and a detection unit. The detection unit detects that the strobe body unit is detached from the imaging apparatus, and the control section has a mode of varying the angle of orientation of the light-emitting unit to a predetermined detached-state angle of orientation based on a detection result by the detection unit. With such a configuration, it is possible to realize the strobe device which can obviate an unnecessary operation by a user.

Abstract: A strobe device is provided with a light-emitting unit rotatably coupled to a strobe body unit detachable from a bracket together with an imaging apparatus, a variable mechanism configured to allow a change in an angle of orientation of the light-emitting unit with respect to the strobe body unit, a driving unit configured to drive the variable mechanism, and a control section configured to control the driving unit. The control section has a control mode to restrain the light-emitting unit from moving to a region in which the imaging apparatus is located when it is detected that the strobe body unit is attached to the bracket. As a result, the strobe device whose the light-emitting unit does not bump against the imaging apparatus can be realized.

Abstract: An image display device includes a light source which emits light, a display element which receives the light, from the light source for generating display light, a light guiding plate which causes the display light to propagate therein, an incident element which allows the display light from the display element to be incident into the light guiding plate, and a dynamic output diffraction element provided in the light guiding plate for outputting the display light to the outside of the light guiding plate. The dynamic output diffraction element includes dynamic diffraction segment elements configured such that a diffraction function of diffracting light is invalidated or validated by voltage application. The image display device further includes a control unit which controls the dynamic output diffraction element such that one dynamic diffraction segment element whose diffraction function is validated is selected each at a time from among the dynamic diffraction segment elements.

Abstract: An acoustic wave element includes a piezoelectric substrate, an excitation electrode configured to excite and output a main acoustic wave on the piezoelectric substrate, a receiving electrode configured to receive the main acoustic wave, a propagation path configured to allow the main acoustic wave to propagate along the piezoelectric substrate between the excitation electrode and the receiving electrode, and a sensing portion configured to react to an object substance. The propagation path is configured to allow the main acoustic wave to pass plural times through the sensing portion along the propagation path. This acoustic wave element has high sensitivity to the object substance.

Abstract: A portable terminal charging apparatus for charging a portable terminal includes a body case which has a portable terminal mounting plate and is disposed on an upper face thereof, a charging coil which is movably provided in the body case opposed to a lower face side of the portable terminal mounting plate, driving unit for moving the charging coil so as to be opposed to the lower face side of the portable terminal mounting plate, and controller which is connected to the driving unit and the charging coil. The charging coil is provided with a support leg which is extended downward.

Abstract: A signal transmitting connector of the present disclosure includes a connection terminal portion comprising a terminal that executes at least one of outputting of an electric signal to an external device or inputting of the electric signal from an external device, a connector portion comprising a photoelectric converting portion that executes photoelectric conversion between an optical signal and the electric signal, and a cable holding portion that holds an optical fiber transmitting the optical signal, the cable holding portion comprising one or a plurality of cable holding portion mirror(s) each forming an optical path between the optical fiber and the photoelectric converting portion.

Abstract: A polarity-switching amplifier circuit includes: a first amplifying transistor and a second amplifying transistor, a transformer which includes a primary winding and a secondary winding, and a polarity-switching controller. An unbalanced input signal is input to the first amplifying transistor and the second amplifying transistor. The transformer receives an output signal of the first amplifying transistor and an output signal of the second amplifying transistor as a balanced signal input to the primary winding, and outputs a signal from the secondary winding. The polarity-switching controller turns on one of the first amplifying transistor and the second amplifying transistor and turns off the other thereof.

Abstract: A deformation state of a predetermined specific site as a site of singulated substrates where the electrodes are liable to be positionally deviated due to deformation is detected for each of the singulated substrates. In component mounting operation for picking up electronic components, and mounting the electronic components on the singulated substrates, it is determined whether the mounting of the electronic component on the specific site of the singulated substrates is suitable or not, based on the detection results of the deformation state for each of the singulated substrates. The operation of mounting all of the electronic components on the singulated substrate having the specific site determined to be not suitable in mounting is canceled.

Abstract: The signal processing device in accordance with the present invention includes: a frequency analyzer to convert a sensor signal corresponding to a radio wave reflected by an object into a frequency domain signal, and extract, by use of a group of individual filter banks with different frequency bands, signals of the individual filter banks from the frequency domain signal; a normalizer to normalize intensities of the signal passing through the individual filter banks by a sum of the signals extracted by the frequency analyzer or a sum of intensities of signals passing through predetermined filter banks, and output normalized intensities; and a recognizer to perform a recognition process of identifying the object based on at least one of a frequency distribution and a component ratio of the normalized intensities calculated from the normalized intensities of the individual filter banks outputted from the normalizer.

Abstract: There is provided a method for manufacturing an electronic component package. The method includes the steps: (i) disposing a metal pattern layer on an adhesive carrier; (ii) placing at least one kind of electronic component on the adhesive carrier, the placed electronic component being not overlapped with respect to the metal pattern layer; (iii) forming a sealing resin layer on the adhesive carrier, and thereby producing a precursor of the electronic component package; (iv) peeling off the adhesive carrier of the precursor, whereby the metal pattern layer and an electrode of the electronic component are exposed at the surface of the sealing resin layer; and (v) forming a metal plating layer such that the metal plating layer is in contact with the exposed surface of the metal pattern layer and the exposed surface of the electrode of the electronic component.