Patents Assigned to Panduit Corp.
  • Patent number: 12142390
    Abstract: Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: November 12, 2024
    Assignee: Panduit Corp.
    Inventors: Royal O. Jenner, Timothy J. Houghton, II, Masud Bolouri-Saransar, Ronald A. Nordin
  • Publication number: 20240369793
    Abstract: Apparatuses and methods are provided that relate to the improvement of the interconnection density and cable management of data center fiber optic networks by including a cassette module having a multilayer interface configuration. The cassette modules utilizes depth within an internal space to accomplish the multilayer interface configuration, which results in improved connector density, while maintaining simple connection schemes.
    Type: Application
    Filed: April 25, 2024
    Publication date: November 7, 2024
    Applicant: Panduit Corp.
    Inventors: Jose M. Castro, Thomas M. Sedor, Ryan N. Murphy, Yu Huang, Bulent Kose
  • Patent number: 12135458
    Abstract: An apparatus and method of inspection are provided that inspects the end-face of two or more fiber optic connectors simultaneously without the need to move a probe from one end-face to another end-face and inspecting them one by one.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: November 5, 2024
    Assignee: Panduit Corp.
    Inventors: Yu Huang, Jose M. Castro, Andrew R. Matcha
  • Publication number: 20240353628
    Abstract: An optical interconnection assembly and method for the deployment and scaling of optical networks employing Spine-and-Leaf architecture has Spine multi-fiber optical connectors and Leaf multi-fiber optical connectors. The Spine optical connectors of the interconnection assembly are optically connected to multi-fiber connectors of Spine switches via Spine patch cords. The leaf multi-fiber connectors are optically connected to Leaf multi-fiber connectors of Leaf switches via Leaf patch cords. A plurality of fiber optic cables in said interconnection assembly serves to optically connect every Spine multi-fiber connector to every Leaf multi-fiber connector so that every Spine switch is optically connected to every Leaf switch. The optical interconnection assembly facilitates the deployment of network Spine-and-Leaf interconnections and the ability to scale out the network by using simplified methods described in this disclosure.
    Type: Application
    Filed: February 29, 2024
    Publication date: October 24, 2024
    Applicant: Panduit Corp.
    Inventors: Jose M. Castro, Richard J. Pimpinella, Bulent Kose, Yu Huang
  • Patent number: 12122551
    Abstract: A wire guide assembly is provided for the accurate labeling of different diameter elongated objects, wires, or cables within a wrapping mechanism of an elongated object label applicator. The label applicator guide permits elongated objects of different diameters to be placed within substantially the center of the wrapping mechanism to continuously facilitate proper application of a label to different sized elongated objects.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: October 22, 2024
    Assignee: Panduit Corp.
    Inventors: Roger D. Segroves, Kevin L Nelson
  • Publication number: 20240337680
    Abstract: A reliable fault detection and management system is described for providing safe high-voltage DC power delivery and distribution. The high voltage power delivery system provides a safer, more reliable, and easy-to-install power delivery system, while also providing for an RF communication link over a high-voltage single pair conductor cable.
    Type: Application
    Filed: March 14, 2024
    Publication date: October 10, 2024
    Applicant: Panduit Corp.
    Inventors: Walid Balid, Masud Bolouri-Saransar
  • Patent number: 12105338
    Abstract: The present invention provides modular trays having cutout features that are configured to engage with a mounting feature of one or more removable rails. The removable rails may be removably secured to a tray body in a plurality of positions to allow a user to install or uninstall rails to support different sized fiber optic modules. For example, a tray may support a twenty-four optical fiber module, two twelve optical fiber modules, or three eight optical fiber modules. Fiber optic enclosures housing the trays can be affixed to the outside of a fiber optic enclosure and allow for easy stacking and unstacking.
    Type: Grant
    Filed: June 6, 2023
    Date of Patent: October 1, 2024
    Assignee: Panduit Corp.
    Inventors: Thomas M. Sedor, Jerry A. Wiltjer, Robert A. Reid, Joseph E. Sanders, Joel D. Kwasny, Bon B. Sledzinski
  • Publication number: 20240314964
    Abstract: An equipment rail mounted in a data center cabinet to support rack mounted equipment in the data center cabinet. The equipment rail includes a first section and a second section. A finger mounting bracket is secured to the second section of the equipment rail. The finger mounting bracket has a first member with sidewalls and a second member parallel to the first member. The distal ends of the sidewalls engage the equipment rail to form an open area between the first member and the second section of the equipment rail.
    Type: Application
    Filed: March 14, 2023
    Publication date: September 19, 2024
    Applicant: Panduit Corp.
    Inventor: Tomasz K. Waz
  • Patent number: 12095500
    Abstract: Methods for estimating the Effective Modal Bandwidth (EMB) of laser optimized Multimode Fiber (MMF) at a specified wavelength, ?S, based on the measured EMB at a first reference measurement wavelength, ?M. In these methods the Differential Mode Delay (DMD) of a MMF is measured and the Effective Modal Bandwidth (EMB) is computed at a first measurement wavelength. By extracting signal features such as centroids, peak power, pulse widths, and skews, as described in this disclosure, the EMB can be estimated at a second specified wavelength with different degrees of accuracy. The first method estimates the EMB at the second specified wavelength based on measurements at the reference wavelength. The second method predicts if the EMB at the second specified wavelength is equal or greater than a specified bandwidth limit.
    Type: Grant
    Filed: July 21, 2023
    Date of Patent: September 17, 2024
    Assignee: Panduit Corp.
    Inventors: Jose M. Castro, Richard J. Pimpinella, Bulent Kose, Brett Lane, Yu Huang, Asher S. Novick
  • Publication number: 20240302600
    Abstract: A fiber optic adaptor has a first face defining a first central axis and a second face opposite the first face defining a second central axis, wherein the first central axis is at an angle relative to the second central axis. In one embodiment, the angle matches the angle of the front face of an APC connector.
    Type: Application
    Filed: May 20, 2024
    Publication date: September 12, 2024
    Applicant: Panduit Corp.
    Inventors: Yu Huang, Jose M. Castro, Andrew R. Matcha, Bulent Kose
  • Publication number: 20240302414
    Abstract: An absence of voltage indicator has an isolation circuit, an FM modulator attached to the isolation circuit, a reference oscillator, and a mixer attached to the reference oscillator and the FM modulator, wherein the output of the mixer is the difference of the two signals. In one embodiment, the FM modulator includes a variable capacitor which varies in response to a voltage in parallel to a fixed capacitor and an inductor in parallel to the capacitors.
    Type: Application
    Filed: May 21, 2024
    Publication date: September 12, 2024
    Applicant: Panduit Corp.
    Inventor: Masud Bolouri-Saransar
  • Publication number: 20240283231
    Abstract: A cable management system designed to support cables in solar applications. The cable management system includes a U-shaped bracket and at least one clamp half. The U-shaped bracket has a base with two arms with each arm including a securement slot. The clamp half has a top, a bottom, a front, a back, and sides with button pads extending from the sides. The clamp half is installed within the U-shaped bracket such that the button pads slide in the securement slots to position the clamp half in the U-shaped bracket. The clamp half separates and supports the cables installed in the U-shaped bracket.
    Type: Application
    Filed: May 1, 2024
    Publication date: August 22, 2024
    Applicant: Panduit Corp.
    Inventors: David J. Sylvester, Rodney G. Rouleau
  • Publication number: 20240264363
    Abstract: A low latency free-space optical data communication channel has at least two opposing parabolic mirrors for transmitting an optical communication signal in the form of a parallel beam across a free-space channel. The input and output of the collimators are multicore optical fibers. Multiple cores of the multicore optical fibers are positioned at the focal points of the at least two opposing parabolic mirrors and the at least two opposing parabolic mirrors image the optical communications signal in each core of the multiple cores of the multicore fibers into corresponding cores of opposing multicore fibers forming at least one optical communication channel.
    Type: Application
    Filed: February 6, 2023
    Publication date: August 8, 2024
    Applicant: Panduit Corp.
    Inventors: Yu Huang, Richard J. Pimpinella, Jose M. Castro, Bulent Kose
  • Publication number: 20240259717
    Abstract: An optical interconnection assembly for a Spine-and-Leaf network is disclosed. The optical interconnection assembly has Spine multi-fiber optical connectors and Leaf multi-fiber optical connectors. The Spine optical connectors of the interconnection assembly are optically connected to multi-fiber connectors of Spine switches via Spine patch cords. The leaf multi-fiber connectors are optically connected to Leaf multi-fiber connectors of Leaf switches via Leaf patch cords. An array of simplex fiber optic cables in said interconnection assembly serve to optically connect every Spine multi-fiber connector to every Leaf multi-fiber connector so that every Spine switch is optically connected to every Leaf switch. The optical interconnection assembly facilitates network Spine-and-Leaf interconnections and the ability to scale-out the network by installing additional assemblies, Leaf switches, and Spine switches.
    Type: Application
    Filed: February 1, 2023
    Publication date: August 1, 2024
    Applicant: Panduit Corp.
    Inventors: Richard J. Pimpinella, Jose M. Castro
  • Publication number: 20240243524
    Abstract: A rear wire cover assembly for a keystone style punchdown jack has a shield wrap and an opening configured to allow the rear wire cover assembly to move in a direction perpendicular to an axis of the cable such as to partially enclose the cable and also such as to allow the rear wire cover assembly to move along the axis of the cable to engage a rear of the keystone style punchdown jack.
    Type: Application
    Filed: June 29, 2023
    Publication date: July 18, 2024
    Applicant: Panduit Corp.
    Inventors: Roman J. Churnovic, Robert E. Fransen
  • Publication number: 20240243526
    Abstract: A rear wire cover assembly for a keystone style punchdown jack has a shield wrap and an opening configured to allow the rear wire cover assembly to move in a direction perpendicular to an axis of the cable such as to partially enclose the cable and also such as to allow the rear wire cover assembly to move along the axis of the cable to engage a rear of the keystone style punchdown jack.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 18, 2024
    Applicant: Panduit Corp.
    Inventors: Roman J. Churnovic, Robert E. Fransen
  • Patent number: 12040583
    Abstract: An apparatus and method for splicing single pair ethernet (SPE) cables. By creating a T shaped intersection, the splicing device allows for sensors and other devices to run perpendicular in relation to the original cable. The splicing device further enables the cable to have multiple drop points along the cable.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: July 16, 2024
    Assignee: Panduit Corp.
    Inventors: Andrew R. Matcha, Surendra Chitti Babu
  • Publication number: 20240236168
    Abstract: A system, device, and method for implementing secure control over audio visual (AV) equipment connected to an AV gateway is disclosed. The solution implements secure and remote control over audio visual (AV) equipment included in an AV network by enabling a web browser running on a user device to utilize a web proxy shuttle to communicate control commands to an AV gateway that controls the AV equipment.
    Type: Application
    Filed: March 22, 2024
    Publication date: July 11, 2024
    Applicant: Panduit Corp.
    Inventors: Daniel M. Renne, Justin A. Kennedy, Joseph P. Bologna
  • Patent number: D1037033
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: July 30, 2024
    Assignee: Panduit Corp.
    Inventor: David J. Sylvester
  • Patent number: D1041425
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: September 10, 2024
    Assignee: Panduit Corp.
    Inventors: David J. Papesh, William J. Wall, Andrew R. Calder, Andrew R. Matcha