Abstract: A mushroom compost leveling apparatus includes a panel with a bottom edge where the panel is vertically suspended in a mushroom compost receptacle leaving a gap between the bottom edge and the floor of the receptacle. The panel reciprocates from side to side as mushroom compost is conveyed under the panel. Optionally, the panel includes vanes extending outwardly from a first face surface, and a rake outwardly and downwardly extending from the panel at or near the bottom edge. Optionally, a pair of wheels are mounted for rotation either to the first face of the panel or to a rail of a frame to be isolated from the panel, and the wheels each include paddles that push compost toward the side edges of the mushroom compost receptacle as the wheels are rotated. Optionally, the leveling apparatus is removably attached to sleeves depending over sidewalls of the compost receptacle, and a roller assembly is removably attached to such sleeves downstream of the leveling apparatus.

Abstract: Apparatus and a method for laying a uniformly thick and, hence, a uniformly dense bed of compost for growing mushrooms and the like are provided. In the shelf system compost is supplied via a conveyer belt from an external supply through the door of a conventional mushroom house to a transverse, variable speed, reversible distributor which distributes the compost uniformly across the shelf at one end thereof onto a moving belt or web, which belt moves along the floor of the shelf from the supply end of the shelf to the far end thereof. The compost which is distributed by the distributor at the supply end moves on the belt toward the far end on the belt, being passed under a rotating, bladed leveling member located in close proximity to the supply end. The blades are set at a height from the floor of the shelf corresponding to the desired thickness of the final compost bed.