Abstract: Thin chamber diaphragm-operated fluid handling devices, including thin chamber pumps and thin chamber valves, facilitate device compactness and, in some configurations, self-priming. Diaphragm actuators of the thin chamber devices either comprise or are driven by piezoelectric materials. The thinness of the chamber, in a direction parallel to diaphragm movement, is in some embodiments determined by the size of a perimeter seal member which sits on a floor of a device cavity, and upon which a perimeter (e.g. circumferential or peripheral portion) of the diaphragm actuator sits. The diaphragm actuator is typically retained in a device body between the floor seal member and another seal member between which the perimeter of the actuator is sandwiched. The devices have an input port and an output port.

Abstract: A method for making a piezoelectric actuator comprises coating at least one of a first surface and a second surface of a piezoelectric element with a polyimide adhesive. The piezoelectric element is then heated to dry the adhesive. Afterwards, the piezoelectric element is inserted between a first metallic layer and a second metallic layer to form an assembly. The assembly is placed in a press. While the assembly is in the press, the polyimide adhesive is cured at a curing temperature which does not depole the piezoelectric element, thereby bonding the piezoelectric element between the first metallic layer and the second metallic layer.

Abstract: A disposable fluid container (20) comprises an integrated pump motive assembly (50) for pumping fluid from an interior of the container. In some example embodiments, the integrated pump motive assembly (50) is situated at least partially within the container housing, e.g., at least partially or even completely submerged inside a fluid reservoir (30) defined by the container housing (22). In other example embodiments, the pump motive assembly is outside the fluid reservoir (30), yet still integrally formed with the container. In yet other embodiments, the pump motive assembly is in a lid (194) of the container. As one aspect of this disposable pump-integrated container technology, the pump motive assembly comprises a displaceable electrodynamic actuator, such as (for example) piezoelectric diaphragm pump, taking any of various configurations.

Abstract: Embodiments of fluid storage containers (312) comprise a displaceable electrodynamic valve (344) for selectively regulating release of fluid from the container. The fluid storage container has a port (342) and comprises means for defining a reservoir (330) for accommodating a pressurizing a fluid. A displaceable electrodynamic valve selectively opens and closes the port and thereby regulates release of the pressurized fluid from the container. In some implementations, the container has a lid (400) and the port is provided in the container lid. In other implementations, the container has a container body, and the port is provided in the container body. The displaceable electrodynamic valve (344) can take various configurations (e.g., flapper, solenoid) and various forms (e.g., piezoelectric valve) in differing example embodiments. In some embodiments a compressor (361) is provided for pressurizing the fluid, and can also take various forms.

Abstract: An actuator assembly comprises a first diaphragm (422) and a second diaphragm (424) connected to the first diaphragm for forming a chamber (426) between the first diaphragm and the second diaphragm. An actuator shaft (427) is connected to first diaphragm (422) and is oriented to extend through the chamber (426) and to extend through an aperture formed in the second diaphragm (424). The second diaphragm (424) can be connected to an actuator body (450) wherein the actuator shaft (427) performs an actuation operation. Alternatively, one or more actuator amplification assemblies (400(B)) can be interposed between the second diaphragm and the actuator body.

Abstract: Example embodiments of piezoelectric pumps and subassemblies for pumps (including diaphragm pumps, both piezoelectric and non-piezoelectric) are formed with structure and/or materials suitable for electromagnetic bonding, and are formed by electromagnetic bonding processes, such as laser welding, for example. In a first example embodiment of electromagnetic bonding pump fabrication technology, a pump (20) is comprised of a base member (22) and a diaphragm layer (24). The diaphragm layer (24) covers at least a portion of the base member and defines a pumping chamber (26) between the base member (22) and the diaphragm layer (24). The diaphragm layer (24) comprises a piezoelectric central region (30) selectively deformable upon application of an electrical signal for pumping fluid into and out of the pumping chamber (26). An electromagnetically transmissive region (32) essentially surrounds the central piezoelectric region (30).

Abstract: A multilayer valve subassembly (50) comprises an interface layer (60) having an interface layer flap (62, 64); a cover layer (70) having a cover layer flap (72, 74); and, an intermediate layer (80) positioned between the interface layer and the cover layer. The intermediate layer (80) has an intermediate layer flap (82, 84) essentially aligned with the interface layer flap and the cover layer flap. A first bond (102) adheres the cover layer (70) to the interface layer (60); a flap bond (92, 94) seals the interface layer flap (82, 84) between the cover layer flap (72, 74) and the interface layer flap (62, 64) and thereby forms a multilayer valve flap (52, 54) which is insulated from fluid which travels through the valve. In an example embodiment, the each of the interface layer flap, the cover layer flap, and the interface layer flap has a substantially U-shape.

Abstract: A laminated piezoelectric composite comprises a metallic substrate (20); a piezoelectric wafer (32) having a first surface and a second surface; a first adhesive carrier layer (100) between the first surface of the piezoelectric wafer (32) and the substrate (22); a first conductive lead (110) carried by the first adhesive carrier layer (100) and connected to a first surface of the piezoelectric wafer (32); and, a second conductive lead (100?) connected to the second surface of the piezoelectric wafer (32). The first adhesive carrier layer (100) serves both to adhere the first surface of the piezoelectric wafer (32) to the substrate (22) and to carry a first conductive lead (110) for supplying an electrical signal or voltage to the first surface of the piezoelectric wafer (32). The second conductive lead (110?) supplies an electrical signal or voltage to the second surface of the piezoelectric wafer (32). The first adhesive carrier layer can comprise a high dielectric soluble aromatic polyimide film.

Abstract: An electrically driven actuator (20, 120) comprises a deformable member (22, 122) which deforms as a function of applied voltage. A coupler (30) connects the deformable member to a shaft (40, 140) which, depending on embodiment and mode of operation, may be either displaceable along its axis or stationary. A controller (50, 150) actuates the deformable member by applying voltage in a manner to cause the coupler, as a function of applied voltage, either to engage or slip relative to the shaft, thereby causing relative displacement of the shaft and the deformable member. In one embodiment and mode of operation, the shaft (40) is displaceable and comprises an actuator element, whereas in another embodiment and mode of operation the deformable member (122) comprises the moveable actuator (121). Preferably, the controller actuates the deformable member to cause linear relative displacement of the shaft and the deformable member.

Abstract: Thermal exchange systems integrate a thermal transfer unit (22); a fluid cooling assembly (24); a pump (26); and a fan (28). The thermal transfer unit (22) interfaces with a body to be thermally conditioned and transfers thermal energy to a fluid. The fluid cooling assembly (24) cools the fluid obtained from the thermal transfer unit. The fan (28) directs air around the fluid cooling assembly (24). The pump (26) circulates fluid in a circuit comprising the pump (26), the fluid cooling assembly (2), and the thermal transfer unit (22). In one aspect of integrated system technology, the fan (28) and the circuit are compactly arranged and substantially situated entirely within a footprint (33) of a module housing (30). As another technological aspect, the fluid cooling assembly (24) comprises plural thermal dissipation plates (45) which are laminated together. In an example, non-limiting mode, the plural thermal dissipation plates (45) have features formed thereon by etching or stamping.

Abstract: A diaphragm assembly (20) comprises at least two piezoelectric diaphragm members (22) arranged in a stacking direction (23). An interface layer (24) is situated between adjacent piezoelectric diaphragm members (22). The interface layer (24) in the stacking direction (23) is displaceable but incompressible. The interface layer (24) permits lateral movement of the adjacent piezoelectric diaphragm members (22) relative to the interface layer (24) in a direction perpendicular to the stacking direction (23). The interface layer (24) can comprise, for example, an incompressible liquid or a semi-liquid. A gasket (26) can be used to seal the incompressible substance in the interface layer if necessary.

Abstract: A piezoelectric diaphragm member (23) has an aperture (25). Preferably the piezoelectric diaphragm (23) is a multi-layer composite which includes a piezoelectric wafer layer. In some embodiments, the aperture (25) in the piezoelectric diaphragm accommodates a diaphragm accessory or fixture. The diaphragm accessory or fixture is preferably inserted through the plural layers of the multi-layer composite piezoelectric diaphragm member, and as such has an accessory or fixture body suitably sized for snug (e.g., fluid-tight) insertion or adhesion into the diaphragm aperture. Within its periphery the accessory or fixture body can include a feature such as a valve (e.g., ball valve, duckbill, flapper valve) or a projection (e.g., a stud or standoff, for example). The projection of the fixture or accessory can be configured, arranged, or adapted to engage or actuate further apparatus.

Abstract: A pump comprises a body for at least partially defining a pumping chamber (28); a pump member which undergoes displacement when acting upon a fluid in the pumping chamber; and a piezoelectric element which responds to the displacement of the pump member to generate an electric current. The electric current generated by the piezoelectric element is preferably applied to a charge storage device which is coupled to the piezoelectric element. The storage device can take various forms, including but not limited to a battery (50, 150, 250), a capacitor (52, 152, 252), and a power supply for the pump (54). In one example embodiment, the pump member is a diaphragm (26) which undergoes the displacement when acting upon a fluid in the pumping chamber. In this example embodiment, the piezoelectric element responds to the displacement of the diaphragm to generate the electric current.

Abstract: Actuator assemblies comprise an actuator element and two piezoelectric assemblies, with the two piezoelectric assemblies being configured and arranged for controlling movement of the actuator element. In some example implementations, the first piezoelectric assembly and the second piezoelectric assembly are constructed and arranged so that a temperature dependency of the first piezoelectric assembly is cancelled by the temperature dependency of the second piezoelectric assembly. In a first example embodiment, a first piezoelectric assembly comprises a first or main piezoelectric diaphragm connected to the actuator element for displacing the actuator element in response to displacement of the first piezoelectric diaphragm. The first piezoelectric diaphragm is mounted to a movable carriage. A second piezoelectric diaphragm, which comprises the second piezoelectric assembly, is connected to the carriage for displacing the carriage in response to displacement of the second piezoelectric diaphragm.

Abstract: Thin chamber diaphragm-operated fluid handling devices, including thin chamber pumps and thin chamber valves, facilitate device compactness and, in some configurations, self-priming. Diaphragm actuators of the thin chamber devices either comprise or are driven by piezoelectric materials. The thinness of the chamber, in a direction parallel to diaphragm movement, is in some embodiments determined by the size of a perimeter seal member which sits on a floor of a device cavity, and upon which a perimeter (e.g. circumferential or peripheral portion) of the diaphragm actuator sits. The diaphragm actuator is typically retained in a device body between the floor seal member and another seal member between which the perimeter of the actuator is sandwiched. The devices have an input port and an output port.

Abstract: A method of manufacturing piezoelectric actuators (14) is disclosed along with a miniature diaphragm pump (10) using the actuators. The object was an actuator which could be used in miniature diaphragm pumps and other applications and which would be smaller in size and simpler to manufacture than prior art actuators, yet would provide forces and displacements an order of magnitude higher than any previously known devices of similar size. The pump (10) incorporates the new actuator along with a novel one-way valve (200) and a small driver circuit (18). The pump is of direct application in the liquid cooling systems of small computers, and in other fluid systems.

Abstract: A piezoelectric power generator (20, 120) comprises plural piezoelectric devices (22, 122); an actuator (24) positioned to impart an excitation to the plural piezoelectric devices (22, 122) in a predefined sequence; and, an electrical conduction system (30) connected to the plural piezoelectric devices for conducting an electrical charge created by the excitation. Preferably the plural piezoelectric devices (22, 122) are arranged in a predetermined relationship relative to the actuator (24) whereby only one of the plural piezoelectric devices (22, 122) is actuated at a time. For example, the plural piezoelectric devices (22, 122) can be arranged in an angular pattern (such as a circular pattern) relative to the actuator (24). Preferably, a rotational speed of the actuator (24) permits an excitation response for a given plural piezoelectric device (22, 122) to essentially fully decay before the given plural piezoelectric device (22, 122) is again excited.

Abstract: A thermal transfer device (20) comprises a housing having a base assembly (23) and a cover (22). The base assembly (23) comprises a thermal transfer base (25) and a fluid-porous, thermally conductive mesh structure (26). The thermal transfer base (25) and the cover (22) cooperate to define a thermal transfer chamber (24). The thermally conductive mesh structure (26) is configured and positioned in the chamber (24) to provide a tortuous, thermal conduction path for fluid (e.g., a coolant) which turbulently travels from an inlet (40) of the chamber to one or more outlets (42) of the chamber (24). In some embodiments, the mesh structure comprises wires which are fused by diffusion bonding into a mesh, in other embodiments the mesh comprises a metallic wool. Within the chamber the mesh structure (26) can have various configurations for providing an exposure interface between fluid pumped through the chamber and the mesh.

Abstract: A heat sink (20) comprises a heat sink monolith (23) and a cover (22). The heat sink monolith (23) comprises a thermal transfer plate (25) and a wire mesh structure (26). The thermal transfer plate (25) of the monolith (23) and the cover (22) cooperate to define a heat transfer chamber (24). The wire mesh structure (26) of the monolith (23) is configured and positioned in the chamber (24) to provide a tortuous, heat conduction path for fluid (e.g., a coolant) which turbulently travels from an inlet (40) of the chamber to one or more outlets (42) of the chamber (24). The wire mesh structure comprises wires which are fused by diffusion bonding (rather than by soldering) into a mesh. The diffusion bonding of the wires provides the wire mesh structure with many and appropriately sized interstices, making it easier to push the fluid through the heat sink assembly and thereby significantly reducing the size and power of the pump which pushes the fluid.