Abstract: Disclosed is an LED light bulb that also serves a night light, including a reflection structure, a cover, a circuit board, a heat dissipater, a power connector, and a light guide bar. The heat dissipater is mounted between and coupled with a cover and a power connector, the reflection structure is mounted to a top of the cover, the light guide bar has one end connected to the reflection structure, the multiple LED elements mounted on the circuit board which is attached to the heat dissipater, and the LED elements emits light that gets incident to the light guide bar.

Abstract: Disclosed is an LED light bulb with large-angle light emission, which includes a reflection structure, a cover, a circuit board, a heat dissipater, and a power connector. The reflection structure is detachably mounted to a top of the cover. The heat dissipater has a top end coupled to a bottom end of the cover. The circuit board includes at least one LED element mounted thereon. The circuit board is attached to the heat dissipater in such a way that the circuit board is housed in the cover to allow the at least one LED element to project light toward the cover and the reflection structure. The power connector is mounted to a bottom end of the heat dissipater.

Abstract: A high-brightness light-emitting diode is disclosed. The high-brightness light-emitting diode, comprises: a chip; a base for holding the chip; and a transparent layer for covering the chip, wherein the chip is connected to an electrode by a metal wire. The improvement comprises an adhesive injection hole formed on the transparent layer for injecting a layer of fluorescent-powdered adhesive into it, thereby providing the light-emitting diode with the advantages such as good light collection and uniform light shape.

Abstract: A flip chip structure for light emitting diode includes a silicon substrate having a surface on which a number of conductors are mounted in an equally spaced manner with an open space formed between adjacent conductors and a number of chips each forming, on the same surface, positive terminal and negative terminal. The chips are mounted to the surface of the substrate in a flip chip fashion with the positive and negative terminals thereof engaging corresponding ones of the conductors of the substrate to form electrical connection therebetween whereby opposite ends of each conductor form positive and negative electrodes for the chips connected thereto. Ends of the conductors that are not engaged by the chips function as external terminals for connection with an external power source.

Abstract: A sideway-projecting light emitting diode (LED) includes an enclosure made of a light-transmitting material having first and second opposite side faces. The first side face forms a light-focusing portion. First and second conductive terminals are fixed in the enclosure and have tails extending beyond the second side face. A support member made of conductive materials has an inner end fixed in the enclosure between the first and second terminals and a remote end extending beyond the side face. A bowl is formed on the inner end of the support member for receiving and retaining a chip substantially confronting the light-focusing portion and electrically connected to the first and second terminals. A heat dissipation plate is mounted to the remote end of the support member for enhancing heat dissipation of the light emitting diode which in turn allows for increased power consumption of the light emitting diode and increased brightness of the light emitted from the light emitting diode.

Abstract: A light emitting diode (LED) packaging structure with built-in rectification circuit is disclosed. The LED packaging structure includes an LED and a rectification circuit is formed inside the LED. Thus, the LED packaging structure is capable to receive an alternate current from an electrical main by the rectification circuit which converts the alternate current into a direct current for the LED whereby the LED can be directly connected to the electrical main and powered thereby without use of additional and external rectification device.

Abstract: A sideway-projecting light emitting diode (LED) includes an enclosure made of a light-transmitting material having first and second opposite side faces The first side face forms a light-focusing portion First and second conductive terminals are fixed in the enclosure and have tails extending beyond the second side face. A support member made of conductive materials has an inner end fixed in the enclosure between the first and second terminals and a remote end extending beyond the side face A bowl is formed on the inner end of the support member for receiving and retaining a chip substantially confronting the light-focusing portion and electrically connected to the first and second terminals.

Abstract: A method for mounting an external heat dissipater to a light emitting diode is disclosed. The heat dissipater is comprised of at least one heat dissipation board. A long metal strip is conveyed through a working platform and is punched to form a number of heat dissipation boards connected thereto by connection sections. Light emitting diodes are positioned on the heat dissipation boards and the heat dissipation boards are cut and separated from the metal strip to form finished products of light emitting diodes to which a heat dissipater comprised of the heat dissipation board is mounted.

Abstract: A light emitting diode (LED) device includes a substrate having a major surface on which a number of LED chips are formed and arranged in a two-dimensional array. The LED chips have a p-type semiconductor and an n-type semiconductor. The n-type semiconductor of each LED chip is electrically connected to the p-type semiconductor of the adjacent LED chip, whereby the LED chips are connected in series. The p-type semiconductor of the starting LED chip and the n-type semiconductor of the ending LED chip are connected to conductors for electrical connection with an external power source. The arrangement of serially connected LED chips allows enhancement of the brightness of a single LED device when the size of the LED device is increased. The working voltage is also increased and the working current can be kept low. Interfacing equipment between the LED device and external power source can be simplified.

Abstract: A heat dissipation device is mounted to a light emitting diode device for removing heat from the light emitting diode which includes a substrate having a top side on which a light-emitting unit is formed and an opposite bottom side from which terminals extend. The heat dissipation device includes a plate made of heat conductive material and forming a receptacle for receiving and at least partially enclosing and physically engaging the substrate of the light emitting diode device for enhancing heat removal from the light emitting diode device.

Abstract: A light emitting diode includes a frame having increased thickness to enable a bowl portion thereof to have an increased depth more than 0.6 mm. Radiating blocks are provided below the frame and a layer of radiation-enhancing material is applied over bottoms of the frame and the radiating blocks to increase a radiating area of the light emitting diode. And, leads are downward extended from two outer sides of the frame. The light emitting diode therefore has increased radiation efficiency and light-emitting efficiency.