Abstract: Described herein are methods for generating a coated device, electrode, or portion of an electrode for implanting into a subject. Such devices and electrodes are generated using methods like atomic layer deposition. In some cases, methods like etching are used to expose portions of a coated surface. The methods described herein improve overall hermeticity, biocompatibility, and biostability of implantable devices.

Abstract: A system for monitoring neural activity of a living subject is provided. The system may comprise a correspondence module configured to be in communication with (1) a neural module and (2) one or more additional modules comprising a sensing module, another neural module, and/or a data storage module. The neural module(s) are configured to collect neural data indicative of perceptions experienced by the living subject. The sensing module may be configured to collect (1) sensor data indicative of real-world information about an environment around the living subject, and/or (2) sensor data indicative of a physical state or physiological state of the living subject. The data storage module may be configured to store prior neural data and/or prior sensor data.

Abstract: A system for monitoring neural activity of a living subject is provided. The system may comprise a correspondence module configured to be in communication with (1) a neural module and (2) one or more additional modules comprising a sensing module, another neural module, and/or a data storage module. The neural module(s) are configured to collect neural data indicative of perceptions experienced by the living subject. The sensing module may be configured to collect (1) sensor data indicative of real-world information about an environment around the living subject, and/or (2) sensor data indicative of a physical state or physiological state of the living subject. The data storage module may be configured to store prior neural data and/or prior sensor data.

Abstract: A neural-interface probe is provided. The probe may comprise a chip, a wire bundle substrate, and an encapsulant material. The chip may comprise a plurality of bond pads. The wire bundle substrate may comprise a plurality of wires extending through the substrate. The plurality of wires may comprise: (1) a proximal portion connected to the plurality of bond pads to thereby couple the chip to the substrate, and (2) a flexible distal portion configured to interface with neural matter. The encapsulant material may be disposed at least between the chip and the wire bundle substrate.

Abstract: A system and method for creating desired splay patterned microelectrodes is disclosed. A bundle of microwires is arranged into a desired splay pattern. This may be performed mechanically with a rigid frame, electronically by charging the microwires, or with some other technique. The microwires in the desired splay pattern are then heated to release internal tension. Upon completion of heating, the microwires are then slowly cooled such that the splayed microwires will retain the desired splay pattern. Insulation may then be added to the microwires if the microwires are not already insulated.