Abstract: An LED illumination device and a color temperature switching method thereof are provided. The LED illumination device includes a bridge rectifier chip, a microcontroller module, a first semiconductor switch module, a second semiconductor switch module, a first current limiting module, a second current limiting module, and a first light-emitting module and a second light-emitting module. The microcontroller module includes a microcontroller chip. The first semiconductor switch module includes a first semiconductor switch chip for receiving a first pulse width modulation signal output from the microcontroller chip. The second semiconductor switch module includes a second semiconductor switch chip for receiving a second pulse width modulation signal output from the microcontroller chip. When the AC power is supplied to the LED illumination device, the first and the second semiconductor switch modules are turned on and maintained within a predetermined turn-on percentage range without being completely turned off.

Abstract: An LED illuminating device without using a capacitor includes a surge absorber group, a three-phase rectifier bridge module, an LED chip group and a current-limiting chip group. The surge absorber group includes a first surge absorber electrically connected between the first and the second AC power input terminal, and a second surge absorber electrically connected between the second and the third AC power input terminal, and a third surge absorber electrically connected between the third and the first AC power input terminal. The three-phase rectifier bridge module is electrically connected to the first, the second and the third AC power input terminal. The LED chip group is electrically connected to the three-phase rectifier bridge module. The current-limiting chip group is electrically connected to the bridge rectifier group. The LED illuminating device can generate a lighting source through a three-phase power provided by a three-phase power supply.

Abstract: An LED illumination device for rapidly releasing residual capacitance, which includes a bridge rectifier chip, a current-limiting chip, a light-emitting group, a resistor group and a capacitor. The light-emitting group includes a plurality of first and second LED chips. The resistor group includes a plurality of first and second resistor chips. The first working voltage of the first LED chip is different from the second working voltage of the second LED chip. The first resistance value of the first resistor chip is different from the second resistance value of the second resistor chip. Each first LED chip corresponds to one of the first resistor chips, and each second LED chip corresponds to one of the second resistor chips. When the power supply is turned off, the residual capacitance remaining in the capacitor can be released by cooperation of the first resistor chips and the second resistor chips.

Abstract: An LED illumination device for improving anti-surge capability includes a circuit substrate, a bridge rectifier chip, a surge absorber group, a first anti-surge current-limiting chip group, a second anti-surge current-limiting chip group, an LED illuminating group, and an LED current-limiting group. The surge absorber group is disposed on the circuit substrate and electrically connected to the bridge rectifier chip for absorbing a surge voltage. The first anti-surge current-limiting chip group is disposed on the circuit substrate for absorbing a first predetermined surge voltage. The second anti-surge current-limiting chip group is disposed on the circuit substrate for absorbing a second predetermined surge voltage. The LED illuminating group includes a plurality of LED chips disposed on the circuit substrate. The LED current-limiting group is disposed on the circuit substrate for controlling a total harmonic distortion of current (THDi) of the LED illuminating group.

Abstract: An illumination device includes a first light-emitting module, a second light-emitting module and an airflow-guiding structure. The second light-emitting module is adjacent to the first light-emitting module. The airflow-guiding structure includes a receiving casing, a first air inlet pipe in air communication with the receiving casing, and a first air outlet pipe in air communication with the receiving casing. The first light-emitting module is received inside the airflow-guiding structure. When external air flows into the receiving casing through the first air inlet pipe by natural convection, the external air inside the receiving casing is sterilized by a sterilization light source provided by the first light-emitting module, and the external air that has been sterilized by the sterilization light source flows out of the receiving casing through the first air outlet pipe by natural convection, and is then discharged out of the illumination device.

Abstract: An LED illumination device includes a circuit substrate, a bridge rectifier, a current-limiting chip, a resistance switching module and an LED group. The bridge rectifier is disposed on the circuit substrate and electrically connected to the circuit substrate. The current-limiting chip is disposed on the circuit substrate and electrically connected to the circuit substrate. The resistance switching module is disposed on the circuit substrate and electrically connected to the circuit substrate. The LED group includes a plurality of LED chips disposed on the circuit substrate and electrically connected to the circuit substrate. The bridge rectifier, the current-limiting chip, the resistance switching module and the LED group are electrically connected with each other.

Abstract: A two-wire dimming lighting device includes an encoding circuit, a decoding circuit, a light source driving circuit, and an LED light emitting circuit. The encoding circuit wirelessly receives the dimming instruction, encodes an AC power according to the dimming instruction, and then outputs an encoded AC power. The decoding circuit receives the encoded AC power and then decodes the encoded AC power to obtain a light source driving instruction. The light source driving circuit receives the light source driving instruction and controls the changes of light emission of the LED light emitting circuit according to the light source driving instruction. The encoding circuit transmits the encoded AC power to the decoding circuit through a two-wire AC transmission wire.

Abstract: A lighting device for multiple input voltages is provided. The lighting device for multiple input voltages includes a plurality of driving circuits each being electrically connected with the light-emitting unit. Each of the driving circuits receives an AC input voltage, and converts the AC input voltage into a working voltage for use by the light-emitting unit. Each of the driving circuits includes a surge protection device and a rectifier. The surge protection device inputs the AC input voltage. The rectifier is electrically connected with the surge protection device, and rectifies the AC input voltage into the working voltage through the surge protection device for use by the light-emitting unit. A threshold voltage of each of the surge protection devices to prevent a surge is different from each other, so that the AC input voltage received by the driving circuits are different from each other.

Abstract: The present disclosure provides a light-emitting device having an ambient light sensing function, including a light-emitting module, a rectification module, a switch module, a control module, and an ambient light sensing module. The light-emitting module includes a circuit substrate and a plurality of light-emitting elements. The rectification module is electrically connected to the light-emitting module. The switch module includes a semiconductor switch element electrically connected to the light-emitting module. The control module is electrically connected to the rectification module and the switch module. The ambient light sensing module is electrically connected to the control module for receiving an ambient light source.

Abstract: The instant disclosure provides an illumination device and a light-emitting module thereof. The light-emitting module includes a cover structure, a light-emitting structure and an assembled type capacitor assembly. The cover structure has a through opening. The light-emitting structure includes a circuit substrate disposed under the cover structure and a plurality of light-emitting elements disposed on the circuit substrate and exposed from the through opening. The assembled type capacitor assembly includes at least one assembled type capacitor electrically connected the circuit substrate through an assembled type electrical connection assembly, and the at least one assembled type capacitor is separated from the circuit substrate.

Abstract: The prevent invention provides a light-emitting device for providing a flash light source comprising a light-emitting module and a control module. The light-emitting module comprises a circuit substrate and a plurality of light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate. The control module comprises a semiconductor switch element having a MOSFET for turning the light-emitting elements on or off, wherein the semiconductor switch element is electrically connected to the light-emitting elements thereby the light-emitting elements can flash via the semiconductor switch element alternately turning on and off the light-emitting elements.

Abstract: A LED illumination device includes a carrier structure, a suspension structure, and a light-emitting structure. The carrier structure includes a carrier body and a first heat-conducting body fixedly disposed inside the carrier body. The carrier body has an outer thread structure disposed on an outer perimeter surface. The first heat-conducting body has a bottom contacting surface exposed from a bottom side of the carrier body. The suspension structure includes a first suspension element detachably disposed on a top side of the carrier body. The light-emitting structure includes a circuit substrate and a light-emitting unit. The circuit substrate is detachably disposed on the bottom side of the carrier body to contact the bottom contacting surface of the first heat-conducting body, and the light-emitting unit is disposed on the circuit substrate. Therefore, heat generated by the light-emitting unit is guided to the first heat-conducting body through the circuit substrate.

Abstract: A light-mixing multichip package structure includes a circuit substrate, a first light-emitting module, a first package body, a second light-emitting module and a second package body. The first light-emitting module includes a plurality of first light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate. The first package body is disposed on the circuit substrate to enclose the first light-emitting elements. The second light-emitting module includes a plurality of second light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate, and the first light-emitting module and the first package body are surrounded by the second light-emitting elements. The second package body is disposed on the circuit substrate to enclose the first light-emitting module, the second light-emitting module and the first package body.

Abstract: A circuit substrate for carrying at least one light-emitting diode and a light-emitting structure for providing illumination are disclosed. The circuit substrate includes an insulation base layer, a conductive heat-dissipating layer, an insulation covering layer, a conductive circuit structure and a conductive through structure. The conductive heat-dissipating layer is disposed on the insulation base layer. The insulation covering layer is disposed on the conductive heat-dissipating layer. The conductive circuit structure includes a first electrode conductive layer and a second electrode conductive layer that are disposed on the insulation covering layer. The conductive through structure passes through the insulation covering layer and is connected between the conductive heat-dissipating layer and one of the first electrode conductive layer and the second electrode conductive layer.

Abstract: A method of manufacturing a multichip package structure includes providing a substrate body; placing a plurality of light-emitting chips on the substrate body, the light-emitting chips being electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, the semidrying surrounding light-reflecting frame having a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, the semidrying surrounding light-reflecting frame contacting and surrounding the package colloid body.

Abstract: An illumination device including a voltage transformer module, a switching unit, a control module, a sensor module, a first illumination module and a second illumination module. The switching unit is coupled to the rectifier module and the voltage transformer module. The control module is coupled to the switching unit and the voltage transformer module. The sensor module is electrically connected to the control module. The sensor module senses an invading object within an induction area. The first illumination module is electrically connected to the switching unit. The second illumination module is electrically connected to the sensor module. The sensor module supplies electricity to the second illumination module to emit light. The sensor module outputs a sensing signal to the control module when the sensor module senses the invading object. The control module controls the switching unit to be turned on so that the first illumination module emits light.

Abstract: Disclosed is an AC light emitting device. The AC light emitting device is electrically connected to an AC power, and the AC power is rectified by a rectification module and inputs an input voltage. The AC light emitting device comprises a buck module, a switching unit, a control module and an AC lighting emitting module. The buck module is electrically connected to the rectification module. The switching unit is electrically connected to the rectification module and the buck module. The control module is electrically connected to the switching unit and the buck module. The AC lighting emitting module is electrically connected to the switching unit. The control module outputs a pulse waveform signal to the switching unit according to the input voltage and a dimming signal, and the switching unit turns on or off the AC lighting emitting module according to the pulse waveform signal.

Abstract: A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried colloid outer layer totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.

Abstract: A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.

Abstract: A multichip package structure includes a substrate unit, a light-emitting unit, a control module, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The control module includes at least one current-limiting unit and the rectifier unit electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting unit and the rectifier unit. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting unit and the rectifier unit.