Abstract: Systems and methods for forming microfeatures in a chip. A microfeature mold may be formed from a thermally stable photopolymer using a three-dimensional (3D) printing process. The microfeature mold may include a first half having a cavity alignment feature and a recess and a second half having a microfeature pattern and a core alignment feature. A thermoplastic sheet may be placed within the recess. The thermoplastic sheet may be compressed between the first half and the second half of the microfeature mold using a compression apparatus. One or more of the first half of the microfeature mold and the second half of the microfeature mold may be heated to a temperature above the glass transition temperature of the thermoplastic sheet, thereby causing the compressed thermoplastic sheet to flow and one or more microfeatures to be formed.