Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: A patternable bonding material for joining the surfaces of two or more substrates permits localization of conductive or insulating hard-cored particles within an adhesive matrix to form patterned structures on or between the surfaces. Electrical, thermal, or mechanical energy may be transferred through, or isolated by the material. The material may be used in an uncured state to allow easy separation of the joined surfaces, or a more permanent bond may be formed. The adhesive may be cured by thermocuring, evaporation or ablation of organic components, pressure, or by the application of ultraviolet radiation.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.