Abstract: Apparatus for transporting semiconductor chips defining electronic circuitry or the like including a base layer of deformable anti-static film; a thin plastic body layer having a first surface to which the base layer adheres, the body layer having one or more cavities shaped to hold chips; and an anti-static holding layer adhering to a surface of the body layer opposite the base layer, the holding layer being less deformable than the base layer and provided with openings through which a chip defining electronic circuitry or the like may be inserted into one of the cavities and will be held in place therein by the holding layer.