Abstract: The present invention pertains to a composite structure comprised of a matrix material, such as metal, and a plurality of cubic boron nitride particles dispersed within and surrounded by the matrix material. In a first embodiment, the composite structure is used as an electronic package to house an electrical device such as an integrated chip. The cubic boron nitride particles are dispersed within the matrix material in proportion such that the coefficient of thermal expansion of the package essentially matches that of the electronic devices. In another embodiment, the composite structure can be used as a thermal conductor, such as a heat sink. Since cubic boron nitride particles have the highest thermal conductivity of any ceramic, they act in combination with the matrix metal to transfer heat efficiently. In another embodiment, the composite structure can be used as a component subject to attrition. The cubic boron nitrides offer unexcelled wear resistance and transfer the heat efficiently.

Abstract: The present invention is a system comprising an element having a specific coefficient of thermal expansion and a metal matrix composite having a coefficient of thermal expansion which essentially matches that of the element. The composite is in contact with the element such that heat can be transferred therebetween. The composite comprises reinforcement material infiltrated with a matrix material having magnesium or a magnesium alloy. If desired, inserts may be loaded into the mold to create specific features in the resulting composite. Other inserts such as other metals, tubes or leachable cores may be used to create features inside of the magnesium composite such as metal seal rings made out of kovar or stainless steel cooling channels or substrates. Preferably, magnesium is infiltrated, assisted by pressure, into reinforcement material to form a metal matrix composite comprised of a reinforcement material infiltrated with matrix material surrounded by a pure metal skin of magnesium.

Abstract: A method of forming a metal matrix composite. The method comprises the steps of surrounding at least one insert with reinforcement material. Next, there is the step of orienting the insert and reinforcement material within a mold. Then, there is the step of infiltrating the mold with liquid metal such that the reinforcement material around the insert is infiltrated. A package comprising a metal matrix composite formed of reinforcement material infiltrated with metal. The package also comprises an insert supported in the reinforcement material by the metal. An electronic package comprising a first wall and a second wall integrally connected and extending in a continuous manner from the first wall. The first wall and second wall are a metal matrix composite formed of reinforcement material infiltrated with metal. The metal extends continuously from the first wall to the second wall. Additionally, there is an insert disposed in the reinforcement material and supported by the metal.

Abstract: The present invention describes a component with an in-situ formed insulator and a method of forming a component of the same. The method includes the step of orienting an insulator in a mold. Then, there is the step of introducing molten material, such as metal into the mold about the insulator to form a component having a cast-in electrical feed-through. Preferably, the feed-through is hermetically sealed within the component. In one embodiment, the insulator has at least one hole and the introducing step includes the step of filling the mold with molten metal to bond the metal to the insulator and to fill the hole with metal. Preferably, after the introducing step, there is the step of removing any skin of metal between metal within the hole and metal outside of the insulator. After the removing step, there can be the steps of drilling a hole into the metal within the insulator and inserting a conductor into the hole. The conductor can be brazed or cemented to the metal within the insulator.

Abstract: The present invention is a method of cooling. The method comprises the steps of positioning material in a liquid state within a chamber. Then, there is the step of providing pressurized fluid about the chamber to form a thermal gradient across the chamber to directionally cool the material within. Preferably, the positioning step includes the step of positioning a mold with a mold chamber having material in a liquid state in the mold chamber, within an interior of a pressure vessel. Preferably, the providing step includes the step of introducing fluid, such as gas, into the pressure vessel such that the fluid that initially enters the pressure vessel is heated to a greater temperature than fluid subsequently introduced into the pressure vessel due to the fluid absorbing heat from the interior of the pressure vessel.

Abstract: The apparatus comprises a vessel having an interior. A mold is disposed within the interior of the vessel. A casting material is contained in the interior of the vessel. The apparatus also comprises a mechanism for providing the casting material to the mold in a manner such that vapors of the casting material are prevented from communicating with the interior of the vessel. The providing mechanism is in communication with the vessel. The providing mechanism comprises an inner chamber within which the mold and casting material are contained in. The providing mechanism further comprises a mechanism for heating the inner chamber, such as heating coils. The heating mechanism is disposed within the interior of the vessel adjacent to the inner chamber. Preferably, the inner chamber has a tube extending therefrom having a filter element, disposed therein for catching vapors of the casting material.

Abstract: A method for producing composite materials by forming one material in a die cavity such that another material can be forced into the same die cavity and infiltrate the spaces in the first material. A method for producing a composite comprising the steps of injecting reinforcement material in a binder or suspension into a die cavity; burning off or removing the binder or suspension such that the reinforcement material remains in the die cavity; injecting liquid metal into the same die cavity such that it infiltrates the reinforcement material; solidifying the liquid metal; and removing the metal infiltrated composite material from the die cavity. An apparatus comprised of a die and a die cavity disposed inside the die. The apparatus is also comprised of a first port extending from the die cavity to the surface of the die through which reinforcement material in a binder is injected into a die cavity.

Abstract: A method and system for producing a continuous supply of low volume fraction composite material that can be fed continuously into one or more molds. Composite inputs are fed into a mixing device such that a continuous supply of mixed composite material is available from the output side of the mixing device. The operation removes the step of creating master ingots and removes the need for a two step process in which the material is melted twice. This invention reduces the cost of producing composite components, reduces batch-to-batch variations, and allows for a continuous production flow. In addition, the invention allows for a much greater flexibility in the selection and optimization of material systems.

Abstract: The present invention describes a plated component and plating method in which the plating adheres to the reinforcement particles on the surface of a composite component. This allows the component to be processed above 400.degree. C. without blistering. The plating method allows brazing, such as gold/tin and gold/germanium brazing, maintains hermeticity, and prevents corrosion over a sustained period of time. By utilizing an activator such as palladium, which can produce catalytic sites on which electroless nickel can be deposited, a component with a surface of exposed reinforcement particles can be plated to form a uniform surface without voids. It has been found that by using a combination of nickel-boron and a palladium activator, that Al/SiC composites can be plated with good adhesion when exposed to temperatures above 400.degree. C.

Abstract: The present invention pertains to a composite structure comprised of a matrix material, such as metal, and a plurality of diamond particles dispersed within and surrounded by the matrix material. In a first embodiment, the composite structure is used as an electronic package to house an electrical device such as an integrated chip. The diamond particles are dispersed within the matrix material in proportion such that the coefficient of thermal expansion of the package essentially matches that of the electronic devices. In another embodiment, the composite structure can be used as a thermal conductor, such as a heat sink. In yet another embodiment, the composite structure can be used as a component subject to attrition. The diamonds offer unexcelled wear resistance and transfer the heat efficiently. The invention is also a method of producing a diamond composite structure including comprising the steps of casting diamond particles, binding particle and flow medium into a mold.

Abstract: The present invention pertains to an electronic package. The package has an internal portion having reinforcement, which is infiltrated with metal. There is a pure metal skin about the internal portion such that the internal portion is hermetically sealed. The metal skin is comprised purely of the metal infiltrated within the reinforcement and forms a continuum with the metal within the reinforcement.

Abstract: The present invention is a method of cooling. The method comprises the steps of positioning material in a liquid state within a chamber. Then, there is the step of providing pressurized fluid about the chamber to form a thermal gradient across the chamber to directionally cool the material within. Preferably, the positioning step includes the step of positioning a mold with a mold chamber having material in a liquid state in the mold chamber, within an interior of a pressure vessel. Preferably, the providing step includes the step of introducing fluid, such as gas, into the pressure vessel such that the fluid that initially enters the pressure vessel is heated to a greater temperature than fluid subsequently introduced into the pressure vessel due to the fluid absorbing heat from the interior of the pressure vessel.

Abstract: The apparatus for casting comprises a pressure vessel and a device for pressurizing the vessel. The pressurizing device is in fluidic connection with the vessel. The apparatus is also comprised of a chamber disposed in the pressure vessel within which material is melted. There is a mold adapted to contain a preform disposed in the vessel and in fluidic connection with the chamber by a passage such that melted material in the chamber can be forced down into the mold through the passage as the pressurizing device pressurizes the vessel. A heating device is disposed in the vessel. There is also a device for directionally solidifying the material in the mold. Additionally, there is a method comprising the steps of loading the pressure vessel by disposing a material within the chamber whereby the material is in fluidic connection with the mold adapted to contain a preform through the passage. The passage has a filter disposed therein.