Abstract: A relay socket is attachable to a cutout in a panel. The relay socket includes a base, at least one rocker beam element at one side of said base, and at least one active snap element at the opposite side of said base. The elements are constructed and arranged so that the socket may be inserted into place by engaging the rocker beam element on one side of a cutout in a panel and pivoting the active snap element toward the opposite side of the cutout so that it engages the opposite side of the cutout and moves inwardly and is inserted into the cutout in the panel in which position it moves outwardly to engage the opposite side of the cutout and the elements cooperatively hold the socket onto the panel. There is also an assembly which includes the relay socket 12. This assembly includes the panel with a cutout into which the relay socket is to be attached as well as the relay itself in the other side of the panel from the relay.

Abstract: A socket for a ball grid array integrated circuit package (BGA) with an array of electrical contacts that extend through holes in a slidable plate. The arrangement of spacing the holes and the electrical contacts therein provides entry openings that allow the ball contacts of a BGA package to enter the openings. The contacts are cupped or angled to mate with the side and top of the ball contacts of the ball grid array package. The contact surface of the ball grid array package is inserted into the socket without any interfering structure, and there may be guide surfaces to align the ball contacts with the openings. A manually rotatable cam actuated in one direction by an arm drives the plate parallel to the plane of the ball contacts to widen the openings to allow easy entry of the balls into the holes. Rotating the arm in the other directions drives the plate in the opposite direction reducing the openings.

Abstract: A modular bus interconnect system suitable for ganging together modules where the electronic signals are bussed to respective contacts on each module. The modules may be releasably or permanently attached to each other. The modules each have a slot for receiving and electrical contacts for making electrical connections to the contact fingers of an edge board connector. Each of the module's electrical contacts has a cantilever portion for making electrical connections to the connector fingers, and, in addition to the cantilever portion, each module has at least two exposed electrical contact portions that are formed on the outside of the housing. When the modules are ganged together these exposed portions are arranged to make electrical connections with each other thereby distributing the signals among all ganged modules.

Abstract: An electrical connector for joining individual, electrically conductive wires, to a printed circuit board. The wires may be individual solid or stranded types. A contact, provided within the connector housing, is arranged with a first end forming an area for attaching the wire and with a second end arranged usually with female contacts for connecting to a header on the printed circuit board. The wires are stripped of any insulation and mechanically attached to a contact in the connector. The wire is placed between a pressure plate and an area of the contact. A screw is rotated forcing the pressure plate and the contact area together physically squeezing the wire so that the wire is securely attached to the contact area to provide a good electrical contact. The second end of the contacts forms a female cantilevered contact arranged to mate with a header of a row of male pins soldered to the printed circuit board.

Abstract: A socket for a ball grid array integrated circuit package (BGA) with an array of electrical contacts (*12) that extend through holes in a slidable plate. The arrangement of spacing the holes (14) and the electrical contacts therein provide entry openings that allow the ball contacts (16) of a BGA package to enter the openings. The contacts are cupped or angled to mate with the side and top of the ball contacts of the ball grid array package. The contact surface of the ball grid array package is vertically inserted into the socket without any interfering structure, and there are guide surfaces to align the ball contacts with the openings. The plate (3) is driven parallel to the plane of the ball contacts in a manner that reduces the entry hole opening by means of a rotating cam placed at one end rotated by a torsion spring.