Abstract: A socket for a ball grid array integrated circuit package (BGA) with an array of electrical contacts that extend through holes in a slidable plate. The arrangement of spacing the holes and the electrical contacts therein provides entry openings that allow the ball contacts of a BGA package to enter the openings. The contacts are cupped or angled to mate with the side and top of the ball contacts of the ball grid array package. The contact surface of the ball grid array package is inserted into the socket without any interfering structure, and there may be guide surfaces to align the ball contacts with the openings. A manually rotatable cam actuated in one direction by an arm drives the plate parallel to the plane of the ball contacts to widen the openings to allow easy entry of the balls into the holes. Rotating the arm in the other directions drives the plate in the opposite direction reducing the openings.