Abstract: Methods for manufacturing an electronic device include providing a substrate having a plurality of radio-frequency components provided thereon, the radio-frequency components including an antenna and a matching circuitry. A cap is attached to the substrate over the antenna and the matching circuitry and a molding operation is performed to encapsulate the cap and at least a portion of the substrate with a mold compound.
Type:
Grant
Filed:
July 20, 2020
Date of Patent:
October 4, 2022
Assignee:
PCI PRIVATE LIMITED
Inventors:
Handi Kartadihardja, Nelson Ranola, Chi Wei Yap, Stephen Conner
Abstract: An antenna system includes a first substrate, the first substrate being a dielectric substrate, a first patch on a first surface of the dielectric substrate and a second patch on a second surface of the dielectric substrate. The first and second patches are coupled to form a first capacitor with the dielectric substrate. A second substrate is coupled to the first substrate and a ground layer is provided on a first surface of the second substrate. An antenna feed is coupled to the second substrate.