Abstract: A signal management system that includes a chassis and a plurality of signal management modules supported by said chassis. Each module has a housing with input and output connectors and electronic circuitry electrically connecting the input and output connectors. One of the input and output connectors is a miniature coaxial connector. Each of the input and output connectors of the modules being connected to cables carrying one of either RF and optical signals.
Type:
Grant
Filed:
September 15, 2004
Date of Patent:
November 28, 2006
Assignee:
PCI Technologies, Inc.
Inventors:
John Lee, Richard Martin, Brad Nikkari, Luc Matteau, Tasos Lambos, Troy Beggs
Abstract: An electrical connector including an outer housing that defines an inner bore between first and second open ends. The first open end being adapted to engage a mating electrical connector and the second open end being adapted to receive a conductor. A contact assembly is slidably received in the inner bore and includes a contact adapted to engage a contact of the mating electrical connector. The contact assembly is movable between a first position near the second open end of the outer housing and a second position.
Abstract: An RF management system especially suitable for use in CATV head end environments is disclosed. The system is characterized by a basic rack-mountable chassis component that can be configured for both front and rear mount applications, for different cable management solutions and for accepting eighteen passive RF modules or nine active RF modules or a combination of passive and active RF circuit modules. The active configuration of the chassis has an integrated power bus with at least nine connectors for receiving up to nine active RF circuit modules. The active RF circuit modules, such as power supplies and amplifiers are each provided with a “floating” connector for ease in connecting the power supply module or amplifier module to the power bus. The RF power supply module is capable of supplying power to all the active RF modules in the chassis as well as to active RF modules mounted in one or more other chassis in the rack.
Abstract: An amplifier housing assembly is disclosed. The housing assembly includes a first section including a first plurality of holes; and a second section including a second plurality of holes. The first and second sections are interconnected. The first and second sections have a common back wall and a common bottom plate. The first plurality of holes and the second plurality of holes are at two different parallel planes.