Abstract: A low profile integrated assembly for dissipating heat from an electronic component includes a heat sink having a peripheral envelope, and a self-contained motorized fan unit for generating a flow of air being embedded substantially within the envelope of the heat sink. The heat sink includes a generally flat heat transferring bottom base plate and a multiplicity of elongated heat dissipating fins attached on and extending upwardly from the bottom base plate. The multiplicity of heat dissipating fins define a cavity. The fins include at least a pair of outer fins being spaced from one another and disposed along a pair of opposite sides of the base plate so as to define a pair of opposite sides of the cavity. The fins also include a plurality of inner fins disposed between the pair of spaced outer fins so as to define a bottom of the cavity being spaced above the base plate.