Abstract: The present disclosure discloses a semiconductor structure having an insulating layer disposed on a wafer active surface of a semiconductor wafer for covering the wafer active surface. The insulating layer may be a protective layer in some embodiments and a cover layer in other embodiments. The insulating layer has via openings to expose contact pads for leading out electrical connections. In particular, the via openings are formed by a multi-step etching process (such as a two-step etching process) without damaging the contact pads. The two-step etching process includes a first laser etching process using normal pulse (P) and normal energy to form partial via openings in the cover layer. The second etching process includes either a laser etching process using low P and low E or a plasma etching process. The second etching process avoids damaging the contact pads.

Abstract: A wafer-level buffer layer is disclosed. The wafer-level buffer layer is configured to prevent cracking and chipping the back-end-of-line (BEOL) dielectric during wafer singulation process. The wafer-level buffer layer is a composite wafer-level buffer layer with a vibration damping agent. The vibration damping agent includes a polymer-based base layer with fillers. The damping agent absorbs or dampens the vibration of the saw blade during dicing to prevent cracking and chipping of the BEOL dielectric.

Abstract: The present disclosure discloses a method of packaging a chip and a chip package structure. The method of packaging the chip includes: forming a protective layer on a front surface of a chip to be packaged; mounting the chip to be packaged formed with the protective layer on the front surface on a first carrier, the back surface of the chip to be packaged facing upwards and a front surface thereof facing towards the first carrier; forming a first encapsulation layer, the first encapsulation layer being formed on the back surface of the chip to be packaged and the exposed first carrier; and detaching the first carrier to exposed the protective layer.

Abstract: The present disclosure provides a chip packaging method and a package structure. The chip packaging method comprises: forming a wafer conductive layer on a wafer active surface of a wafer; forming a protective layer having certain material properties on the wafer conductive layer, the protective layer encapsulating the wafer conductive layer and exposing a front surface of the wafer conductive layer; separating (such as cutting) the wafer formed with the wafer conductive layer and the protective layer to form a die; attaching (such as adhering) the die onto a carrier; forming a molding layer having certain material properties on a die back surface of the die on the carrier; removing (such as stripping off) the carrier; forming a panel-level conductive layer electrically connected with the wafer conductive layer; and forming a dielectric layer.

Abstract: The embodiments of the present disclosure relate to a packaging method, a panel assembly, a wafer package and a chip package. The semiconductor device packaging method includes: providing at least one wafer including a first surface and a second surface opposite to each other and a side surface connecting the first surface and the second surface, the first surface being an active surface; forming a connection portion on the side surface of the at least one wafer around the wafer, the wafer and the connection portion forming a panel assembly, the connection portion includes a third surface on the same side of the first surface of the wafer and a fourth surface on the same side as the second surface of the wafer, the third surface and the first surface forming a to-be-processed surface of the panel assembly; and forming a first dielectric layer on the first surface of the wafer. The packaging method of the embodiments of the present disclosure may improve packaging efficiency and utilization of a wafer.

Abstract: The present disclosure provides a chip packaging method and a package structure. The chip packaging method comprises: forming a protective layer having material properties on a die active surface of a die; attaching (such as adhering) the die in which the die active surface is formed with the protective layer onto a carrier, the die active surface facing the carrier, and a die back surface of the die facing away from the carrier; forming an encapsulation layer having material properties to encapsulate the die; removing (such as stripping off) the carrier to expose the protective layer; and forming a conductive layer and a dielectric layer.

Abstract: The embodiments of the present disclosure relate to a packaging method, a panel assembly, a wafer package and a chip package. The semiconductor device packaging method includes: providing at least one wafer including a first surface and a second surface opposite to each other and a side surface connecting the first surface and the second surface, the first surface being an active surface; forming a connection portion on the side surface of the at least one wafer around the wafer, the wafer and the connection portion forming a panel assembly, the connection portion includes a third surface on the same side of the first surface of the wafer and a fourth surface on the same side as the second surface of the wafer, the third surface and the first surface forming a to-be-processed surface of the panel assembly. The packaging method of the embodiments of the present disclosure may improve packaging efficiency and utilization of a wafer.

Abstract: A semiconductor packaging method, a semiconductor package and stacked semiconductor packages are provided. The method includes providing a carrier (10) having a plurality of semiconductor chip receiving areas (12) and attaching a plurality of first semiconductor chips (14) to the semiconductor chip receiving areas (12). The first semiconductor chips (14) are encapsulated with a first encapsulant (20) and a plurality of electrical connections (24) is formed to the first semiconductor chips (14). At least a portion of the carrier (10) is removed to provide a heat release area (38).

Abstract: The present disclosure discloses a method of packaging a chip and a chip package structure. The method of packaging the chip includes: mounting at least one chip to be packaged on a carrier, a back surface of the chip to be packaged facing upwards and an active surface facing towards the carrier; forming a sealing layer, the sealing layer being at least wrapped around the at least one chip to be packaged; forming a first encapsulation layer, wherein the first encapsulation layer covers the entire carrier for encapsulating the at least one chip to be packaged and the sealing layer; detaching the carrier to expose the active surface of the at least one chip to be packaged; and completing the packaging by a rewiring process on the active surface of the at least one chip to be packaged.

Abstract: A semiconductor processing method is provided. The method includes providing a first carrier (10). A first adhesive (18) is provided on the first carrier (10) and a plurality of semiconductor chips (20) is placed on the first adhesive (18). A second carrier (28) is provided. The second carrier (28) is provided with a plurality of chip receiving areas (32). The first and second carriers (10) and (28) are then brought together to attach the semiconductor chips (20) to respective ones of the chip receiving areas (32) on the second carrier (28). The first carrier (10) is then separated from the semiconductor chips (20).

Abstract: The embodiment of the present disclosure discloses a method of packaging a chip and a chip package structure.

Abstract: A semiconductor processing method is provided. The method includes providing a first carrier (10). A first adhesive (18) is provided on the first carrier (10) and a plurality of semiconductor chips (20) is placed on the first adhesive (18). A second carrier (28) is provided. The second carrier (28) is provided with a plurality of chip receiving areas (32). The first and second carriers (10) and (28) are then brought together to attach the semiconductor chips (20) to respective ones of the chip receiving areas (32) on the second carrier (28). The first carrier (10) is then separated from the semiconductor chips (20).

Abstract: A semiconductor packaging method, a semiconductor package and stacked semiconductor packages are provided. The method includes providing a carrier (10) having a plurality of semiconductor chip receiving areas (12) and attaching a plurality of first semiconductor chips (14) to the semiconductor chip receiving areas (12). The first semiconductor chips (14) are encapsulated with a first encapsulant (20) and a plurality of electrical connections (24) is formed to the first semiconductor chips (14). At least a portion of the carrier (10) is removed to provide a heat release area (38).