Abstract: Binder for a pressure sensitive adhesive, characterized in that it exists as a polymer dispersed in water and obtained by emulsion polymerization of:(A) 65.0-99.4 percent by weight of one or more acrylic esters with 4-18, preferably 6-10 carbon atoms in the alcohol part of the ester, the esters being selected in such a way that a polymerization of only these esters gives a tacky polymer with a Tg-value below 0.degree. C., preferably below -20.degree. C.(B) 2.0-0.1 percent by weight of a polymerizable compound with the formula ##STR1## or with the formula wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are as defined in the specification(C) 5.0-0.5 percent by weight of at least one ethylenically unsaturated acid such as acrylic acid, methacrylic acid or itaconic acidand(D) 28.

Abstract: A method for the production of through holes in a laminate used for printed wiring and consisting of an insulating base of glass fiber reinforced thermosetting resin provided on at least one side with a thin continuous layer of copper or copper alloy, comprising laminating said layer of copper or copper alloy under heat and pressure to a final base-forming material consisting of at least one sheet of glass fiber reinforced thermosetting resin, subsequently drilling or punching holes in said laminate causing the formation of resin smear in said layer of copper or copper alloy and applying a water-jet stream to said resin smear to remove it from said laminate.

Abstract: The invention relates to a water-dilutable binder for lacquers and paints based on synthetic resins microemulsified in water by means of certain emulsifiers.

Abstract: In a process for the production of a multilayer printed board built up by starting from a desired number of insulating bases clad on both sides with an unpatterned metal layer, the improvement consisting in that the metal layers, whereout conductive patterns are to be etched and which layers are to be hidden inside the finished multilayer printed board, are coated with a plating resist in the shape of a negative of the desired conductive pattern, that the remaining visible parts of the metal layers, which are to form the conductive patterns, are coated by electroplating with a thin, rough, adhesion-promoting metal layer comprising copper, zinc, nickel, tin or any one of their alloys, that an etch resist layer of nickel, tin or any one of their alloys is electroplated on top of the adhesion-promoting layer, if the latter consists of copper, zinc or any one of their alloys, that the negative plating resist is removed, that the parts of the metal layers thus uncovered are etched away and that the insulating base

Abstract: A method for the production of through holes in a laminate comprising an insulating base provided with a thin metal layer on at least one side, said laminate being intended for printed wiring. The method is characterized in that the thin metal layer is provided with a firmly adhering and protective foil or layer of a material being chemically different from the thin metal layer and that so-called burrs in the thin metal layer obtained during a mechanical machining of the holes are removed by dissolution whereupon the protective foil or layer can be removed.

Abstract: Backing member of plastic intended to be fixed for example to a wall and to support a decorative wall plate, a shelf, a soap dish, a towel hanger etc., said backing member comprising a mainly square or rectangular plate or frame construction provided with a lock edge at the top, two lock springs at the bottom and one distance ear at each of the four corners, the lock edge and the lock springs being intended to engage with rails, extensions, pins etc. arranged at the inside of a decorative wall plate etc., which is provided with straight, right-angled sides, in such a way that the decorative plate can be firmly but yet dismountably secured to the backing member.

Abstract: A method for the production of a material for printed circuits is disclosed. A temporary base is coated by electroplating with a thin, unbroken and unpatterned metallic layer having a thickness less than 17.mu.m and the free surface of said metallic layer is bonded to a final insulating base. The temporary base is thereafter removed and the desired wiring pattern is produced by a process comprising etching of the metal layer. A material for use in production of printed circuits is also disclosed comprising a temporary base which is coated by electroplating with a thin, unbroken and unpatterned metal layer having a thickness less than 17.mu.m. Said material can comprise a final, insulating base bonded to the free surface of the thin metal layer.

Abstract: Method at recovery of pure 3,3,7,7-tetrahydroxymethyl-5-oxanonane from a distillation residue obtained at the production of trimethylolpropane, wherein the 3,3,7,7-tetrahydroxymethyl-5-oxanonane is crystallized by a simple crystallization from a salt containing aqueous solution of the distillation residue having a specially favorable salt proportion.

Abstract: Secondary stabilizer for vinyl chloride polymers, which stabilizer consists of a solid mixture obtained by melting together trimethylol propane and pentaerythritol and optionally one or more of the compounds selected from the group consisting of dipentaerythritol, tripentaerythritol, neopentyl glycol, trimethylol ethane, ditrimethylol propane, mannitol, sorbitol, anhydroennea heptitol, 1,2,6-hexane triol and glycerol.

Abstract: Process for blending an additive such as colour pigment etc. with a plastic material, wherein the plastic material for instance in the shape of granules, pellets, grains or powder is introduced into a first hopper equipped with a stirrer. The first hopper is placed in a direct connection with a feed screw of a plastic moulding machine. The additive in the shape of granules, pellets, small tablets or big grains is charged into a second hopper which is joined to the first hopper by a dosing part including a dosing plate, which executes reciprocating motions and is equipped with at least one hole, and a dosing pipe, a dosing hose or the like. The amount of additive fed to the first hopper is intended to be regulated by varying the number of reciprocating motions of the dosing plate per unit of time and/or by varying the plate thickness and/or by varying the hole size of the dosing plate and/or by varying the number of holes in the dosing plate.

Abstract: A method for the production of a material for printed circuits is disclosed. A temporary base is coated by electroplating with a thin, unbroken and unpatterned metallic layer having a thickness less than 17 .mu.m and the free surface of said metallic layer is bonded to a final insulating base. The temporary base is thereafter removed and the desired wiring pattern is produced by a process comprising etching of the metal layer. A material for use in production of printed circuits is also disclosed comprising a temporary base which is coated by electroplating with a thin, unbroken and unpatterned metal layer having a thickness less than 17 .mu.m. Said material can comprise a final, insulating base bonded to the free surface of the thin metal layer.

Abstract: A method for the production of a material for printed circuits is disclosed. A temporary base is coated by electroplating with a thin, unbroken and unpatterned metallic layer having a thickness less than 17.mu.m and the free surface of said metallic layer is bonded to a final insulating base. The temporary base is thereafter removed and the desired wiring pattern is produced by a process comprising etching of the metal layer. A material for use in production of printed circuits is also disclosed comprising a temporary base which is coated by electroplating with a thin, unbroken and unpatterned metal layer having a thickness less than 17.mu.m. Said material can comprise a final, insulating base bonded to the free surface of the thin metal layer.