Abstract: A multilayer electrical device such as a printed circuit board, and method for making the electrical device, having a tooth structure for joining at least one of the layers. The method includes the following steps: providing a base; preparing the base and adding a conductive layer to the base; applying a dielectric material to the conductive layer; preparing the applied dielectric material for receipt of the conductive coating; forming openings (vias) through holes in the applied dielectric coating; etching cavities in the applied dielectric material; applying a conductive coating to the cavities in the applied dielectric material; and forming a metal layer on the conductive coating to produce a tooth structure set in the dielectric coating. The tooth structure preferably has obtuse teeth in the range of 1-2 tenths of a mil deep that mechanically join a dielectric material to a subsequently added metal layer.