Abstract: A method and apparatus for automatically loading and unloading wafer crystals to and from a double-sided polishing machine of the type having an upper and a lower polishing plate, runner disks with reception openings for the wafer crystals, and a drive to move runner disks to a predetermined loading and unloading position. The position of the centers of the reception openings in a runner disk located in the loading position is measured and stored by means of an optical identification system. A gripping means of a robot arm is successively oriented towards the measured center positions of the reception openings, and the position of the centers of the individual openings is determined and stored by first and second optical identification systems. The individual wafer crystals are tilted while being inserted by the gripping means of the loading arm into the reception openings.

Abstract: A device for polishing digital storage discs including a polishing plate rotatably driven about a vertical axis, the upper side of which has a polishing cloth, wherein the polishing cloth is interrupted by a ring-shaped recess concentric with the axis of the polishing plate, at least one circular load-applying plate from the planar lower side of which a projection centrally protrudes to appropriately engage the central hole of the storage disk, a roller holder which has at least one idling roller and one driven roller against which the circumference of said load-applying plate gets into engagement when said plate is carried along while lying on said polishing plate, a drive for said driven roller, and mechanism for feeding a polishing medium to said polishing cloth.

Abstract: An apparatus for removing semiconductor wafers from within the runner disks in a double-sided polishing machine. The apparatus includes a suction head adapted to be connected to a vacuum, which has a plurality of suction ports such that all semiconductor wafers received by a runner disk may be gripped simultaneously. The apparatus also includes an arm on which the suction head is rotatably supported about a vertical axis and which, in turn, is pivotally supported about a vertical axis at a spacing from the suction head or is supported so as to be linearly adjustable or adjustable in height. The apparatus also includes a rotary drive for the suction head, a drive for the arm, a lifting drive for the arm, and a control device for activating the drives such that the semiconductor wafers may be deposited on a lay-down device in a predetermined, aligned position.

Abstract: A holder for flat subjects, in particular semiconductor wafers, in particular in a device for the chemical-mechanical polishing of semiconductor wafers, with a plate-like head which can be connected on the upper side to a height adjustable spindle and at the lower side comprises a holding plate which is coupled to a carrier section arranged above the holding plate via a universal joint and which comprises a number of vertical bores which extend to the lower side of the plate and can be connected to a vacuum and/or a fluid source, wherein the holding plate is height adjustably guided in the carrier section, between the carrier section and the holding plate there is arranged an annular closed membrane within which there is formed an essentially air-tightly closed inner space which can be selectively connected to atmosphere or vacuum or to a pressure source.

Abstract: A device for the chemical-mechanical polishing of the surface of an object, in particular of semiconductor wafers for the manufacture of semiconductors, with two polishing units with height-adjustable vacuum holders each for a semiconductor wafer, which can be driven by a drive motor about a vertical axis, parallel, approximately horizontally running guides, along which the polishing units are guided independently of one another, drive means by which the polishing units are moved along the guides, at least one polishing plate rotatingly driven below the guides, which is arranged approximately symmetrically on both sides of the longitudinal axes of the guides, by which means the polishing units in their corresponding operational position cooperate with oppositely lying sections of the polishing plate, at least one transfer and take-over device for the semiconductor wafer, at the end of the guides which is opposite to the polishing plate, two depositing and accommodating devices for the semiconductor wafer, whi

Abstract: A polishing machine comprising a frame, an upper and a lower working wheel each having opposing working surfaces, at least one of the working wheels being rotatably supported by the frame and driven by driving means, with a plurality of runner wheels being located between the working surfaces of the upper and the lower working wheel, the runner wheels having aperatures for the accommodation of work pieces and a toothing at the circumference thereof, an outer and an inner circular row of equally spaced pins, the pins being retained by a respective pin ring, the toothing of the runner wheels engaging the outer and the inner row of pins for the forward and rotating movement of the runner wheels if at least one of the row of pins is rotated, second driving means for the rotating row of pins, a source for the supply of working fluid and/or rinsing fluid between the working surfaces, interception means on the outer and the inner side of the working wheels, with the outer of the interception means being formed by a