Abstract: A process for the use of an aqueous cleaning composition to remove organic material from a substrate. The cleaning composition preferably includes a nonionic surfactant and may also include a glycol ether solvent.

Abstract: A liquid cleaning composition comprising a solvating agent and a rinsing agent, the ratio of the vapor pressure of said rinsing agent to the vapor pressure of said solvating agent being at least about 20 and the use thereof to clean substrates that have soil adhered thereto.

Abstract: The present invention deals with a process for conditioning hair and skin using a novel guerbet based quat compounds. These materials are useful in personal care applications, where mildness, skin feel and conditioning on hair are desired.

Abstract: An industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith, for example, a printed circuit board contaminated with rosin flux, comprising: (A) contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material, for example, a surfactant, for a period of time sufficient to solubilize the contaminant; (B) removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F.

Abstract: A process for removing soil from a substrate which includes the use of a liquid cleaning composition comprising a solvating agent (for example, a monobasic ester) and a rinsing agent (for example, a perfluorocarbon), the solvating agent having:(i) a room temperature vapor pressure of no greater than about 40 mm Hg; and(ii) a solvating strength of no less than about 10; and the rinsing agent having:(iii) a room temperature vapor pressure of about 8 mm Hg to about 760 mm Hg; and(iv) an ozone depleting factor of no greater than about 0.

Abstract: An aqueous cleaning composition having a pH of about 6 to about 8 and comprising a solution of the following ingredients: water, an organic solvent and an imidazoline-based cationic surfactant, each present in an amount effective to dissolve adherent soils from a substrate; and a nonionic surfactant in an amount sufficient to maintain said cationic surfactant in solution; and also a weak organic acid in an amount sufficient to impart to the composition said pH; wherein said composition is substantially free of any material which has an ozone-depletion factor of greater than about 0.15 and wherein said composition is substantially free of any material which would tend to form a solid with any of the ingredients comprising the composition, and its use to clean metallic and non-metallic surfaces.

Abstract: A process for removing soil from a substrate which includes the use of liquid cleaning composition including a solvating agent (for example, a monobasic ester) and a rinsing agent (for example, a perfluorocarbon), the solvating agent having:(i) a room temperature vapor pressure of no greater than about 40 mm Hg; and(ii) a solvating strength of no less than about 10;and the rinsing agent having:(iii) a room temperature vapor pressure of about 8 mm Hg to about 760 mm Hg; and(iv) an ozone depleting factor of no greater than about 0.

Abstract: Disclosed is an industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith. The process comprises the steps of contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material; removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water. The process also comprises separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.

Abstract: Disclosed is an industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith. The process comprises the steps of contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material; removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water. The process also comprises separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.

Abstract: Methods and compositions are provided to facilitate the transportation and combustion of highly viscous hydrocarbons by forming reduced viscosity hydrocarbon-in-water emulsions, and in particular, bioemulsifier-stabilized hydrocarbon-in-water emulsions.