Abstract: Process for producing a copper-containing aqueous solution, in which a copper mass is dissolved in the presence of air in an aqueous leach liquor containing monoethanolamine and an acid, wherein the amount of acid equivalents is between 0.05 and about 0.7 times the equivalents of monoethanolamine, and wherein the rate of copper dissolution into the aqueous leach liquor is greater than about 4.3 grams of copper per liter of leach liquor per hour until a product having at least about 80 grams per liter is obtaine.

Abstract: A basic copper salt selected from basic copper carbonate, basic copper sulfate, basic copper acetate, basic copper citrate, and basic copper nitrate is manufactured by contacting copper metal with an aqueous solution having ammonia; an acid selected from carbonic acid, sulfuric acid, acetic acid, nitric acid, or citric acid; and oxygen, under conditions where the copper metal is converted to the basic copper salt; and then recovering the basic copper salt. The most economical embodiment is where the ammonia is present in the aqueous solution is in an amount between about 6.7 g/l and about 15 g/l calculated as NH3, and the pH of the composition is between 8 and 10, and the temperature of the composition is between 25° C. and 100° C. The method is particularly useful if the basic copper salt is basic copper carbonate. The basic copper carbonate produced has the formula: (CuCO3)x(Cu(OH2)y, where y is 1 and x is between 0.1 to less than 1; or where y is 1 and x is 1, or where y is 1 and x is between 0.

Abstract: A method of milling chlorothalonil to form a sub-micron product having a narrow particle size distribution is presented. The milling involves wet milling of the chlorothalonil with high density milling media having a diameter between 0.1 mm and 0.8 mm, preferably between 0.2 mm and 0.7 mm, and a density equal to or greater than 3.8 g/cc, preferably greater than 5.5 g/cc, in a ball mill using between about 40% and 80% loading of the mill volume with milling media, and having the chlorothalonil suspended in an aqueous milling liquid which comprises one or more surface active agents. The milling speed is preferably high, for example from about 1000 rpm to about 4000 rpm. The milled product can be used in foliar applications at a lower effective dosage than prior art formulations, can be used in improved antifouling paint formulations, and can be used in new applications such as the direct injection of solid chlorothalonil particulates in wood to act as a long lasting wood preservative.

Abstract: A wood preservative that contains a copper salt complex and a precipitation inhibitor is provided. The wood preservative may contain copper carbonate, an alkanolamine such as monoethanolamine and precipitation inhibitor such as a phosphonate or ethylene diamine compound. Also provided is a method of using the wood preservative.

Abstract: The invention relates to a compatibilizing dispersant used in a slurry composition comprising a strongly cationic component and a strongly anionic component. More specifically, the invention relates to stable aqueous slurries comprising suspended particles of sparingly soluble salts, oxide, and/or hydroxides of copper and/or zinc. The slurry further comprises a quaternary amine compound present in a biocidally effective amount when the slurry is used in a manner that provides the sparingly soluble copper and/or zinc containing particles in a biocidally effective amount. The slurry further comprises an effective amount of a dispersant having a large non-ionic component.

Abstract: Spent, acidic solutions comprising cupric chloride and hyrdrochloric acid from the copper etching process are regenerated by a process in which the acid is subjected to distillation with sulfuric acid. In one embodiment, the process comprises (a) providing a spent etchant comprising at least about 10% by weight chloride and at least about 5% dissolved copper; (b) adding at least about 2 moles of sulfuric acid per mole of dissolved copper to the spent etching solution, thereby converting copper chloride into hydrochloric acid and precipitated copper sulfate; (c) distilling the mixture from step (b) to vaporize at least a portion of the hydrochloric acid; (d) condensing at least a portion of the vaporized hydrochloric acid; (e) separating at least a portion of the precipitated copper sulfate from the residual liquid, wherein said residual liquid comprises sulfuric acid; and (f) reusing at least a portion of the residual liquid as a sulfuric acid source in step (b).

Abstract: Process for producing a copper-containing aqueous solution, in which a copper mass is dissolved in the presence of an oxidant in an aqueous leach liquor containing monoethanolamine and (HMEA)2CO3. The leach liquor is produced by partially carbonating the monoethanolamine.

Abstract: Process for producing a copper-containing aqueous solution, in which a copper mass is dissolved in the presence of an oxidant in an aqueous leach liquor containing monoethanolamine and (HMEA)2CO3. The leach liquor is produced by partially carbonating the monoethanolamine.

Abstract: A process for activating a zinc-containing ore for flotation in aqueous media, wherein an ammonium-free aqueous cupric chloride solution is added to the media.

Abstract: Copper etchant solution additives for use with an aqueous alkaline ammoniacal cupric chloride etching bath include several compounds, each of which is shown to stabilize the copper(I) state. The compounds discovered by the present invention include iodide ions such as potassium iodide, ammonium iodide, sodium iodide, calcium iodide and magnesium iodide. Other copper(I) stabilizers discovered by the present invention include certain water soluble salts containing sulfur such as a thiocyanate ion (e.g. ammonium thiocyanate, potassium thiocyanate, sodium thiocyanate, magnesium thiocyanate, and calcium thiocyanate) and a thiosulfate ion (e.g. ammonium thiosulfate, potassium thiosulfate, sodium thiosulfate, magnesium thiosulfate, and calcium thiosulfate). Etching rates for alkaline ammoniacal cupric chloride with different concentrations of potassium iodide, ammonium thiocyanate, and sodium thiosulfate were studied.