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Patents
Patents Assigned to Philcom Corporation
Patents Assigned to Philcom Corporation
Hollow microprobe using a MEMS technique and a method of manufacturing the same
Patent number:
7119557
Abstract:
The present invention relates to a hollow microprobe using an MEMS technique and a method of manufacturing the same.
Type:
Grant
Filed:
July 16, 2003
Date of Patent:
October 10, 2006
Assignee:
Philcom Corporation
Inventor:
Oug-Ki Lee