Patents Assigned to Philips Lumileds Lighing Company LLC
  • Light emitting device with bonded interface
    Patent number: 8692286
    Abstract: In some embodiments of the invention, a transparent substrate AlInGaP device includes an etch stop layer that may be less absorbing than a conventional etch stop layer. In some embodiments of the invention, a transparent substrate AlInGaP device includes a bonded interface that may be configured to give a lower forward voltage than a conventional bonded interface. Reducing the absorption and/or the forward voltage in a device may improve the efficiency of the device.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: April 8, 2014
    Assignee: Philips Lumileds Lighing Company LLC
    Inventors: Patrick N. Grillot, Rafael I. Aldaz, Deborah L. Coblentz, Anneli Munkholm, Hanmin Zhao