Patents Assigned to Phillip W. Bishop
  • Carbon dioxide cleaning process
    Patent number: 6004400
    Abstract: A method for cleaning parts employed during the processing of semiconductor wafers includes a first cleaning step for removing super-micron particles and a second cleaning step for removing sub-micron particles. The second step utilizes frozen carbon dioxide pellets and removes contaminant particles have a size of less than one micron. The cleaning method consistently removes substantially all sub-micron particles from a work surface.
    Type: Grant
    Filed: July 9, 1997
    Date of Patent: December 21, 1999
    Assignee: Phillip W. Bishop
    Inventors: Phillip W. Bishop, Alexander J. Harrover