Abstract: Provided is a line beam forming device that can divide a laser beam into beam segments in a first direction (y-axis) perpendicular to the traveling direction (z-axis) of the laser beam, and arrange and emit the beam segments with regular intervals in a second direction (x-axis) perpendicular to the traveling direction of the laser beam, using a single mirror set composed of a plurality of mirrors. The line beam forming device of the present invention can be used for an excimer laser which is a multimode laser beam generator with high beam divergence, a high-power DPSS laser, or a laser diode, can obtain high-density energy by condensing beams, can obtain a beam profile having uniform intensity in both of a long axis and a short axis, and can combine a plurality of laser beams without being influenced by the properties of an incident beam.

Abstract: Provided is a line beam forming device that can divide a laser beam into beam segments in a first direction (y-axis) perpendicular to the traveling direction (z-axis) of the laser beam, and arrange and emit the beam segments with regular intervals in a second direction (x-axis) perpendicular to the traveling direction of the laser beam, using a single mirror set composed of a plurality of mirrors. The line beam forming device of the present invention can be used for an excimer laser which is a multimode laser beam generator with high beam divergence, a high-power DPSS laser, or a laser diode, can obtain high-density energy by condensing beams, can obtain a beam profile having uniform intensity in both of a long axis and a short axis, and can combine a plurality of laser beams without being influenced by the properties of an incident beam.

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.