Abstract: A substrate structure with embedded semiconductor chip and a fabrication method thereof are provided. The method includes: providing a carrier board having a first surface and an opposing second surface, wherein a first opening and an opposing second opening are formed in the first and second surfaces respectively, and a portion of the first opening communicates with the second opening; mounting at least one semiconductor chip to bottom of the first opening to be received in the first opening; filling an adhesive material in the first and second openings and in a gap between the chip and the carrier board to adhere the chip; forming a dielectric layer on the carrier board and the chip; and forming a circuit layer on the dielectric layer and forming conductive structures in the dielectric layer, so that the circuit layer is electrically connected to the chip via the conductive structures.