Patents Assigned to PHOENIX SILICON INTERNATIONAL CORP.
  • Taiko wafer ring cut process method
    Patent number: 11551923
    Abstract: A Taiko wafer ring cut process method is provided. The Taiko wafer ring cut process method includes the following steps. A Taiko wafer is disposed on the platform. The Taiko wafer is performing by laser ring cutting so that a Taiko ring and an edge portion of the Taiko wafer are separated from a wafer portion of the Taiko wafer. The wafer portion of the Taiko wafer is adhered to a frame.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: January 10, 2023
    Assignee: PHOENIX SILICON INTERNATIONAL CORP.
    Inventors: Chien-Hsiung Huang, Chao-Tsung Tsou, Cheng-Yen Lin
  • Manufacturing process of wafer thinning
    Patent number: 10026603
    Abstract: A manufacturing process of wafer thinning includes a step of wafer-grinding to grind a surface of a wafer to a first predetermined thickness, and a step of wafer-etching to etch the grinded face of the wafer with the first predetermined thickness to a second predetermined thickness.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: July 17, 2018
    Assignee: PHOENIX SILICON INTERNATIONAL CORP.
    Inventors: Shih-Ching Yang, Chien-Hsiung Huang, Chao-Tsung Tsou, Cheng-Yen Lin