Abstract: A method is disclosed for electroforming metal screen. The method deposits photoresist over a mandrel, and then exposes the photoresist with light through a plurality of openings in a photo tool to form hardened resist pillars. Unexposed photoresist is removed without affecting the resist pillars. The method then electroforms the metal screen in areas free of the hardened resist pillars such that the metal screen forms apertures defined by each of the resist pillars, a space between at least two of the resist pillars defining a support bar that forms at a reduced thickness as compared to portions of the metal screen that are not between the resist pillars. Finally, the method detaches the metal screen from the mandrel.

Abstract: A stencil comprising two or more layers is disclosed for applying surface mount materials onto printed circuit boards, flexible circuits, wafers or other substrates. The stencil can accommodate preexisting surface mount components and materials. The stencil utilizes material reservoirs, relief areas and delivery apertures and can be used for depositing surface mount materials such as adhesives, conductive glues, solder paste and solder balls.