Abstract: The present invention relates to a novel immersion tin bath composition and a novel and improved method of depositing a smooth, even, metallic tin coating over metallic surfaces, providing improved solderability.

Abstract: Sensitizing solutions for rendering surfaces receptive to the deposition of adherent electroless metal comprising a precious metal and a stoichiometric excess of a Group IV metal which is capable of two valence states are stabilized against precious metal separation by adding a Lewis Base, e.g., hydroquinone or hydroxylamine. Processes for rendering surfaces receptive to the deposition of an electroless metal are also provided in which there are employed the stabilized sensitizing solutions.

Abstract: A process for the production of metallized bodies, such as printed circuits, dials, nameplates, metallized plastics, glass, ceramics and the like, comprising treating a base with a composition comprising a metal salt reducible to catalytically active metal nuclei and a secondary reducing agent, and thereafter exposing the base to a primary chemical reducing agent to produce a layer of metal nuclei on the surface of the base. Exposing the sensitized base to an electroless metal deposition solution causes electroless metal to deposit on the nuclei.

Abstract: Sensitizing solutions for rendering surfaces receptive to the deposition of adherent electroless metal comprising a precious metal and a stoichiometric excess of a Group IV metal which is capable of two valence states are stabilized against precious metal separation by adding a Lewis Base, e.g., hydroquinone or hydroxylamine. Processes for rendering surfaces receptive to the deposition of an electroless metal are also provided in which there are employed the stabilized sensitizing solutions.