Abstract: There is provided a mating clip for securing a connection between an optical connector and an optical port of a hybrid optically enabled integrated circuit package, the optical connector having an optical cable end to which is attached an optical cable and having a connector end opposite the optical cable end, the mating clip comprising: a cover for substantially covering the optical connector, the cover comprising an opening to permit passage of the optical cable; an S-shaped curved feature extending from the cover and for applying a force against the optical cable end; and a hook-shaped feature extending from the cover in the direction of the connector end of the optical connector and for securing an assembly formed by the mating clip and the optical connector to the optical port; wherein, in the securing of mating clip/optical connector assembly, the hook-shaped feature interacts with at least one of a notch internal to the hybrid optically enabled integrated circuit package; and a protrusion on the optica

Abstract: The invention relates to high-strength, abrasion-resistant optical fiber cable having a supplemental layer consisting essentially of a liquid crystal polymer (LCP) to enhance the cable's tensile strength and hermetically seal it, and an outermost encasing layer to protect the LCP supplemental layer from damage that could otherwise diminish the tensile strength or destroy the moisture barrier properties of the cable gained by adding the supplemental liquid crystal polymer layer. The encasing layer is preferably a thin layer of a smooth, non-crystalline thermoplastic that can be easily removed with chemicals that do not affect the properties of the supplemental layer so that the supplemental layer can be made accessible for promoting the formation of hermetically sealed interfaces between the cable and other structures. Cross-head extrusion methods for coating optical fibers with LCP and encasing layers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.

Abstract: An encapsulated device includes a micro device on a substrate, a cover bonded to the substrate thereby forming a chamber to encapsulate the micro device, and a desiccant material on the cover and in the chamber. An anti-stiction material is absorbed in the desiccant material.

Abstract: The invention relates to high-strength, abrasion-resistant optical fiber cable having a supplemental layer consisting essentially of a liquid crystal polymer (LCP) to enhance the cable's tensile strength and hermetically seal it, and an outermost encasing layer to protect the LCP supplemental layer from damage that could otherwise diminish the tensile strength or destroy the moisture barrier properties of the cable gained by adding the supplemental liquid crystal polymer layer. The encasing layer is preferably a thin layer of a smooth, non-crystalline thermoplastic that can be easily removed with chemicals that do not affect the properties of the supplemental layer so that the supplemental layer can be made accessible for promoting the formation of hermetically sealed interfaces between the cable and other structures. Cross-head extrusion methods for coating optical fibers with LCP and encasing layers are described along with laser and ultrasonic bonding techniques for fabricating hermetic packages.

Abstract: A micro-bolometer type infrared (IR) sensing device is provided. The IR sensing device includes an absorbed heat discharging part; a sensing structure part formed as bean structure, spaced apart from the absorbed heat discharging part, supported at least at one end on the absorbed heat discharging part, and discharging heat absorbed in the sensing structure part by being elastically deformed and thus touching the absorbed heat discharging part. The sensing structure part includes: a sensing part with variation in secondary attribute (for example, in electrical resistance property) according to heat; and a light-absorbing part formed into one unit with the sensing part in a manner to surround the sensing part as seen in section view, and converting energy of incident photons into heat. The sensing structure part discharges heat absorbed therein by being elastically deformed and thus touching the absorbed heat discharge part spaced apart downward from the sensing structure part.

Abstract: Switching optical signals containing a plurality of spectral channels characterized by a predetermined channel spacing is described. A selected beam deflector array may be selected from among a plurality of available beam deflector arrays configured to accommodate spectral channels of different channel spacings. The selected beam deflector array is configured to accommodate spectral channels of the predetermined channel spacing. The spectral channels are selectively optically coupled to the selected beam deflector array, which selectively optically couples the spectral channels between one or more input ports and one or more output ports.

Abstract: High speed printed circuit boards (PCBs) are disclosed comprising a dielectrics systems with the back-side trenches, prepregs, signal lines and ground-plans, wherein the signal line and ground-plan are located on the dielectrics. Using of the open trenches in the substrate help to reduce the microwave loss and dielectric constant and thus increasing the signal carrying speed of the interconnects. Thus, according to the present invention, it is possible to provide a simple high speed PCB using the conventional material and conventional PCB manufacturing which facilitates the design of circuits with controlled bandwidth based on the trench opening in the dielectrics, and affords excellent reliability. According to this present invention, high speed PCB with the interconnect system contains whole portion or portion of interconnects for high speed chips interconnects and that have have the dielectric system with opened trench or slot to reduce the microwave loss.

Abstract: A photovoltaic device is provided which includes a plurality of junction layers. Each junction layer includes a plurality of photovoltaic cells electrically connected to one another. At least one of the junction layers is at least in part optically transmissive. The junction layers are arranged in a stack on top of each other.

Abstract: There is described an opto-electronic Integrated Circuit Board (ICB) comprising an ICB substrate; a linear array of cells positioned on the ICB substrate, for optical connection to an array of optical fibers, each one of the cells comprising: a die bond pad and one of a Vertical Cavity Surface Emitting Laser (VCSEL) and a Photodetector; a number of ICB bond pads on the ICB substrate, the number of ICB bond pads corresponding at least to a number of cells in the linear array, wherein each successive ICB bond pad along the linear array is located on alternate sides of the linear array; and wirebonds each connecting, in a one-to-one relationship, each one of the ICB bond pads to a corresponding die bond pad of one of the cells of the linear array.

Abstract: An electronic device includes a circuit protection unit providing over-current protection to a main circuit and including a series connection of first and second current limiting circuits, and a normally-open branch circuit coupled in parallel to the first current limiting circuit and operable to conduct when a voltage across the first current limiting circuit reaches a first predetermined threshold voltage not greater than an endure voltage of the first current limiting circuit. Prior to conduction of the branch circuit, the first current limiting circuit maintains a current flowing therethrough at a first limit value when a current flowing through the main circuit reaches the first limit value. Upon conduction of the branch circuit, the second current limiting circuit maintains a current flowing therethrough at a second limit value greater than the first limit value when the current flowing through the main circuit reaches the second limit value.

Abstract: The present invention is directed to an optical fiber grating having a core, that is capable of controlling the light signal transmission therethrough by causing at least one of: at least one spectral peak, and/or at least one spectral dip in its core light transmission spectrum, corresponding to at least one predetermined wavelength. The inventive optical fiber diffraction grating comprises at least one longitudinally positioned structural element of a predetermined geometric profile and that is configured for diffracting a portion of the transmitted light signal at at least one predefined wavelength thereof, from at least one core mode into at least one of: at least one cladding mode and/or at least one radiating mode. Various embodiments of a number of novel techniques for fabrication of the inventive optical fiber diffraction grating are provided, inclusive of a novel technique for fabricating the inventive grating from a single material.

Abstract: Liquid crystal waveguides for dynamically controlling the refraction of light. Generally, liquid crystal materials may be disposed within a waveguide in a cladding proximate or adjacent to a core layer of the waveguide. In one example, portions of the liquid crystal material can be induced to form refractive or lens shapes in the cladding that interact with a portion (e.g. evanescent) of light in the waveguide so as to permit electronic control of the refraction/bending, focusing, or defocusing of light as it travels through the waveguide. In one example, a waveguide may be formed using one or more patterned or shaped electrodes that induce formation of such refractive or lens shapes of liquid crystal material, or alternatively, an alignment layer may have one or more regions that define such refractive or lens shapes to induce formation of refractive or lens shapes of the liquid crystal material.

Abstract: An easily replaceable lamp cartridge system that provides a narrow line of light and that can be placed into an optical path of an instrument or optical system. The cartridge comprises an integrated lamp, at least one focusing element, cooling components and at least one slit aperture mounted in a housing typically comprising mechanical indexing features and connectors to facilitate easy placement and replacement.

Abstract: An optically-enabled integrated circuit (IC) package for connecting an electrical circuit board to an optical fiber is presented. The IC package comprises an OSA having a laser which is pre-aligned with the optical fiber. The OSA further comprises a standard electrical interface for the connection to the microchip and a standard optical interface for the connection to the optical fiber. A set of mechanical concepts for connecting optical connectors and cables to integrated circuit packages is also presented and can be applied for any type of optical connector such as single optical fiber ferrules, MT-RJ type optical ferrules and 2-D MT-type optical ferrules.

Abstract: A method is provided for producing a thin-film photovoltaic device. The method includes forming on a substrate a first thin-film absorber layer using a first deposition process. A second thin-film absorber layer is formed on the first thin-film absorber layer using a second deposition process different from the first deposition process. The first and second thin-film absorber layers are each photovoltaically active regions and the second thin-film absorber layer has a smaller concentration of defects than the first thin-film absorber layer.

Abstract: An image sensor for detecting a wide spectrum includes a plurality of infrared ray receiving layers which individually receive infrared rays having different wavelengths for each pixel, the plurality of infrared ray receiving layers stacked to each other. The image sensor, which is an integrated image sensor where at least two micro bolometers are stacked, acquires spectrum information about visible rays and near-infrared rays as well as two or more infrared rays applied on an object, without mechanical/thermal/optical distortion, and provides the spectrum information to a silicon-based semiconductor such as a photodiode, thereby improving photoelectric conversion efficiency.

Abstract: A tunable laser for providing a laser beam with a selectable wavelength. In one example, the tunable laser includes a gain medium for generating the laser beam; a waveguide for processing the laser beam, the waveguide having liquid crystal material or other electro-optic material disposed therein; an optical path length control element disposed within said waveguide for controlling an effective optical path length of the laser cavity; and a wavelength selective element for controlling the wavelength of the laser beam. The tunable laser may be designed without any moving mechanical parts if desired.

Abstract: A high speed electrical interconnection system is provided. The interconnection system comprises one or more electrical signal lines, or differential pairs of signal lines, and an inhomogeneous dielectric system. The dielectric system further comprises a homogeneous dielectric layer interposed between the electrical signal lines, and electrical conducting planes including a periodic array etched in the conducting material of the conducting plane. The inhomogeneous dielectric system exhibits a lower dielectric constant as compared to the dielectric constant of the homogeneous dielectric layer, resulting in lower microwave loss, reduced signal propagation delay, reduced signal skew, and increased signal bandwidth. The interconnection system may be implemented for connecting one or more high speed electron elements on-chip, off-chip, chip-chip connection on multilayer printed circuit boards, high speed die-package, high speed connectors, and high speed electric cables.

Abstract: Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables.

Abstract: A semiconductor device for sensing infrared radiation is provided. In an embodiment, the semiconductor device includes a sensor configuration which includes a light receiving portion for converting incident photons into heat and a sensing portion integrated with the light receiving portion and having a resistance varying according to the converted heat; and a sensing circuit which includes a common mode current providing portion and a current subtraction portion, wherein the common mode current providing portion outputs a common mode current related to a value of a current which is flowing in the sensing portion when there is no incident light and the current subtraction portion outputs subtraction currents for the common mode current and a sensing current related to a current output from the sensing portion.