Patents Assigned to PI R&D Co., Ltd.
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Patent number: 11569508Abstract: Provided are a binder resin for an electrode of a lithium secondary battery containing a solvent-soluble polyimide having a repeating unit represented by the following Formula [I], and a method of producing the binder resin for an electrode. (In the formula, Z represents an aromatic or alicyclic tetracarboxylic dianhydride residue, and Ar is an aromatic diamine residue having a carboxyl group and an aromatic diamine residue having an aromatic ether bond, or an aromatic diamine residue having a phenylindan structure).Type: GrantFiled: February 1, 2016Date of Patent: January 31, 2023Assignees: PI R&D CO., LTD., TOP MATERIAL CO., LTD.Inventors: Tetsuaki Suzuki, Shuzo Waki, Whan Jin Roh, Seung Joon Hong
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Patent number: 9949371Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 pm to 3.0 pm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.Type: GrantFiled: August 19, 2016Date of Patent: April 17, 2018Assignees: MITSUBISHI GAS CHEMICAL COMPANY, INC., PI R&D CO., LTD.Inventors: Mitsuru Nozaki, Akihiro Nomoto, Norikatsu Akiyama, Eiji Nagata, Masashi Yano
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Publication number: 20180034057Abstract: Provided are a binder resin for an electrode of a lithium secondary battery containing a solvent-soluble polyimide having a repeating unit represented by the following Formula [I], and a method of producing the binder resin for an electrode.Type: ApplicationFiled: February 1, 2016Publication date: February 1, 2018Applicants: PI R&D CO., LTD., TOP BATTERY CO., LTD.Inventors: Tetsuaki SUZUKI, Shuzo WAKI, Whan Jin ROH, Seung Joon HONG
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Patent number: 9780376Abstract: Disclosed is a highly reliable secondary battery, as well as an electrode and a conductive agent used therefor, which battery has a long cycle life and is also less likely to be damaged or rupture even when the battery temperature becomes abnormally high. The conductive agent of the battery electrode contains, as the main component, a reaction product between a ?-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by coating a composition containing this conductive agent and an electrode active substance onto a current collector. The battery comprises this electrode.Type: GrantFiled: May 13, 2015Date of Patent: October 3, 2017Assignees: PI R&D CO., LTD., MORI POLYMER CO., INC.Inventors: Takaki Mori, Toshiyuki Goshima, Maw Soe Win
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Patent number: 9780375Abstract: Disclosed is a highly reliable secondary battery, as well as an electrode and a conductive agent used therefor, which battery has a long cycle life and is also less likely to be damaged or rupture even when the battery temperature becomes abnormally high. The conductive agent of the battery electrode contains, as the main component, a reaction product between a ?-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by coating a composition containing this conductive agent and an electrode active substance onto a current collector. The battery comprises this electrode.Type: GrantFiled: May 19, 2009Date of Patent: October 3, 2017Assignees: PI R&D CO., LTD., MORI POLYMER CO., INC.Inventors: Takaki Mori, Toshiyuki Goshima, Maw Soe Win
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Publication number: 20160360615Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 ?m to 3.0 ?m and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.Type: ApplicationFiled: August 19, 2016Publication date: December 8, 2016Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., PI R&D CO., LTD.Inventors: Mitsuru NOZAKI, Akihiro NOMOTO, Norikatsu AKIYAMA, Eiji NAGATA, Masashi YANO
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Patent number: 9287424Abstract: Disclosed are a method of forming a back reflection layer in a solar cell, a composition used therefor, and a solar cell having a back reflection layer formed by the method, which layer has superior heat-resistance and various types of durabilities, and can contribute to improving the conversion rate of solar cells and reliability during long-term use, and which method can form a back reflection layer in a solar cell easily and at low cost. The polyimide resin composition for use in forming a back reflection layer in a solar cell includes an organic solvent, a polyimide resin dissolved in the organic solvent, and light-reflecting particles dispersed in the organic solvent.Type: GrantFiled: September 20, 2011Date of Patent: March 15, 2016Assignee: PI R&D CO., LTD.Inventors: Maw Soe Win, Toshiyuki Goshima, Takahiro Sato, Hidenao Takato, Isao Sakata
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Publication number: 20150249251Abstract: Disclosed is a highly reliable secondary battery, as well as an electrode and a conductive agent used therefor, which battery has a long cycle life and is also less likely to be damaged or rupture even when the battery temperature becomes abnormally high. The conductive agent of the battery electrode contains, as the main component, a reaction product between a ?-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by coating a composition containing this conductive agent and an electrode active substance onto a current collector. The battery comprises this electrode.Type: ApplicationFiled: May 13, 2015Publication date: September 3, 2015Applicants: PI R&D CO., LTD., Mori Polymer Co., Inc.Inventors: Takaki MORI, Toshiyuki GOSHIMA, Maw Soe WIN
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Patent number: 8987376Abstract: Disclosed is a polyimide composition for semiconductor devices, which has a rheological characteristics suited for screen printing and dispense coating, which has an improved wetting property with various coating bases, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a desired area. A method of forming a film in a semiconductor and semiconductors having the film formed by this method as an insulation film, protective film or the like are also disclosed. The composition for semiconductor devices contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent.Type: GrantFiled: February 25, 2011Date of Patent: March 24, 2015Assignees: PI R&D Co., Ltd., Mitsubishi Electric CorporationInventors: Toshiyuki Goshima, Sigemasa Segawa, Maw Soe Win, Junichi Yamashita, Ken Takanashi
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Patent number: 8859170Abstract: Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.Type: GrantFiled: April 30, 2010Date of Patent: October 14, 2014Assignee: PI R&D Co., Ltd.Inventors: Toshiyuki Goshima, Maw Soe Win, Sigemasa Segawa, Eika Kyo
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Patent number: 8779085Abstract: The present invention discloses a method of producing a modified polyimide comprising a polycarbonate, which modified polyimide has excellent electric properties and adhesion as well as excellent heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; and the modified polyimide. Also disclosed are a composition comprising the modified polyimide and used thereof.Type: GrantFiled: April 30, 2010Date of Patent: July 15, 2014Assignee: PI R&D Co., Ltd.Inventors: Toshiyuki Goshima, Maw Soe Win, Eika Kyo
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Patent number: 8771496Abstract: A metal composite film having an excellent heat resistance and adhesion, suited for flexible printed circuit boards capable of forming fine wirings, as well as a production process thereof, is disclosed. The metal composite film comprises an insulating film; a thermoplastic polyimide layer(s) formed on at least one surface of the insulating film; and metal layers formed on the surface of each of the thermoplastic polyimide layer(s), which metal layers are formed by electroless plating and then by electrolytic plating, respectively. Since this metal composite film has an excellent heat resistance and adhesion, and maintains the excellent adhesion after forming fine wirings, it is suitably used as a high density flexible printed circuit board having fine circuits.Type: GrantFiled: May 17, 2006Date of Patent: July 8, 2014Assignee: PI R&D Co., Ltd.Inventors: Eiji Nagata, Hiroyuki Ishii
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Publication number: 20130310482Abstract: Disclosed are a method of forming a back reflection layer in a solar cell, a composition used therefor, and a solar cell having a back reflection layer formed by the method, which layer has superior heat-resistance and various types of durabilities, and can contribute to improving the conversion rate of solar cells and reliability during long-term use, and which method can form a back reflection layer in a solar cell easily and at low cost. The polyimide resin composition for use in forming a back reflection layer in a solar cell includes an organic solvent, a polyimide resin dissolved in the organic solvent, and light-reflecting particles dispersed in the organic solvent.Type: ApplicationFiled: September 20, 2011Publication date: November 21, 2013Applicant: PI R&D CO., LTD.Inventors: Maw Soe Win, Toshiyuki Goshima, Takahiro Sato, Hidenao Takato, Isao Sakata
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Publication number: 20130233381Abstract: Disclosed is a polyimide resin composition for forming an insulation layer in a solar cell, which has an optimal rheological characteristics for screen printing and the like, which has an improved wetting property with various coating substrates, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a predetermined area. A method of forming an insulation layer in a solar cell and a solar cell having the insulation layer formed by this method are also disclosed.Type: ApplicationFiled: September 20, 2011Publication date: September 12, 2013Applicant: PI R&D CO., LTD.Inventors: Maw Soe Win, Toshiyuki Goshima, Takahiro Sato
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Publication number: 20130224653Abstract: A novel polyimide which retains the characteristics of polyimides, that is, excellent heat resistance, electrical insulation and chemical resistance, of which dielectric constant is lower than those of the known polyimides, as well as a composition containing the same and a process for producing the same, is disclosed. The polyimide of the present invention is a cross-linked polyimide having a dielectric constant of not more than 2.7, which was produced by polycondensing (a) tetramine(s), (a) tetracarboxylic dianhydride(s) and (an) aromatic diamine(s) in the presence of a catalyst.Type: ApplicationFiled: April 3, 2013Publication date: August 29, 2013Applicant: PI R&D Co., LtdInventor: PI R&D Co., Ltd
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Patent number: 8372257Abstract: A suspension type electrodeposition coating composition containing, as a resin component, block copolyimide having a siloxane bond in a molecular structure and an anionic group in a molecule. Preferably, the above-mentioned block copolyimide contains, as one of the diamine components, diamine having a siloxane, bond in a molecular structure. In addition, preferably, the above-mentioned anionic group is a carboxylic acid group or a salt thereof and/or a sulfonic acid group or a salt thereof. The electrodeposition coating composition has superior heat resistance, which does not easily develop peeling and cracks in the electrodeposited body, and is capable of efficiently forming a high-insulation electrodeposited film superior in the uniformity of film property.Type: GrantFiled: May 7, 2008Date of Patent: February 12, 2013Assignees: Mitsubishi Cable Industries, Ltd., PI R&D Co., Ltd.Inventors: Masanori Fujii, Toshihiro Zushi, Hiromasa Honjo, Toyokazu Nagato, Maw Soe Win, Shintaro Nakajima, Toshiyuki Goshima, Kiyoshi Ishii
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Patent number: 8349537Abstract: Disclosed is a photosensitive ink which can form a coated film that is excellent in insulation properties, heat resistance, low warping, low elasticity and adhesion with the substrate, when used as an ink for screen printing, and with which clogging of the screen, bleeding, blur, chipping and the like are unlikely to occur even when the screen printing is repeatedly carried out, so that which has an excellent ease of handling in printing. The ink composition comprises 100 parts by weight of an organic solvent-soluble polyimide block copolymer(s), and 1 to 100 parts by weight of a photoacid generator(s). The polyimide block copolymer(s) and the photoacid generator(s) are dissolved in an organic solvent. The polyimide block copolymer(s) contain(s) in its molecular skeleton a diamine having a siloxane bond, and an aromatic diamine having a hydroxyl group(s) and/or carboxyl group(s) at ortho-position with respect to an amino group.Type: GrantFiled: January 14, 2011Date of Patent: January 8, 2013Assignee: PI R&D Co., Ltd.Inventors: Maw Soe Win, Toshiyuki Goshima, Sigemasa Segawa, Shintaro Nakajima, Eika Kyo, Yoshikazu Nishikawa, Shuzo Waki
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Publication number: 20120189859Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 ?m to 3.0 ?m and a lightness value of not more than 30 on one surface of an electrolytic copper foil, and form a layer of a resin composition containing a block copolymerized polyimide resin having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.Type: ApplicationFiled: June 25, 2010Publication date: July 26, 2012Applicants: PI R&D CO., LTD., MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Mitsuru Nozaki, Akihiro Nomoto, Norikatsu Akiyama, Eiji Nagata, Masashi Yano
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Publication number: 20120097439Abstract: The present invention discloses a method of producing a modified polyimide comprising a polycarbonate, which modified polyimide has excellent electric properties and adhesion as well as excellent heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; and the modified polyimide. Also disclosed are a composition comprising the modified polyimide and used thereof.Type: ApplicationFiled: April 30, 2010Publication date: April 26, 2012Applicant: PI R&D CO., LTD.Inventors: Toshiyuki Goshima, Maw Soe Win, Eika Kyo
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Publication number: 20120097435Abstract: Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.Type: ApplicationFiled: April 30, 2010Publication date: April 26, 2012Applicant: PI R&D CO., LTD.Inventors: Toshiyuki Goshima, Maw Soe Win, Sigemasa Segawa, Eika Kyo