Patents Assigned to PI R&D Co., Ltd.
  • Patent number: 11569508
    Abstract: Provided are a binder resin for an electrode of a lithium secondary battery containing a solvent-soluble polyimide having a repeating unit represented by the following Formula [I], and a method of producing the binder resin for an electrode. (In the formula, Z represents an aromatic or alicyclic tetracarboxylic dianhydride residue, and Ar is an aromatic diamine residue having a carboxyl group and an aromatic diamine residue having an aromatic ether bond, or an aromatic diamine residue having a phenylindan structure).
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: January 31, 2023
    Assignees: PI R&D CO., LTD., TOP MATERIAL CO., LTD.
    Inventors: Tetsuaki Suzuki, Shuzo Waki, Whan Jin Roh, Seung Joon Hong
  • Patent number: 9949371
    Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 pm to 3.0 pm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: April 17, 2018
    Assignees: MITSUBISHI GAS CHEMICAL COMPANY, INC., PI R&D CO., LTD.
    Inventors: Mitsuru Nozaki, Akihiro Nomoto, Norikatsu Akiyama, Eiji Nagata, Masashi Yano
  • Publication number: 20180034057
    Abstract: Provided are a binder resin for an electrode of a lithium secondary battery containing a solvent-soluble polyimide having a repeating unit represented by the following Formula [I], and a method of producing the binder resin for an electrode.
    Type: Application
    Filed: February 1, 2016
    Publication date: February 1, 2018
    Applicants: PI R&D CO., LTD., TOP BATTERY CO., LTD.
    Inventors: Tetsuaki SUZUKI, Shuzo WAKI, Whan Jin ROH, Seung Joon HONG
  • Patent number: 9780376
    Abstract: Disclosed is a highly reliable secondary battery, as well as an electrode and a conductive agent used therefor, which battery has a long cycle life and is also less likely to be damaged or rupture even when the battery temperature becomes abnormally high. The conductive agent of the battery electrode contains, as the main component, a reaction product between a ?-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by coating a composition containing this conductive agent and an electrode active substance onto a current collector. The battery comprises this electrode.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: October 3, 2017
    Assignees: PI R&D CO., LTD., MORI POLYMER CO., INC.
    Inventors: Takaki Mori, Toshiyuki Goshima, Maw Soe Win
  • Patent number: 9780375
    Abstract: Disclosed is a highly reliable secondary battery, as well as an electrode and a conductive agent used therefor, which battery has a long cycle life and is also less likely to be damaged or rupture even when the battery temperature becomes abnormally high. The conductive agent of the battery electrode contains, as the main component, a reaction product between a ?-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by coating a composition containing this conductive agent and an electrode active substance onto a current collector. The battery comprises this electrode.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: October 3, 2017
    Assignees: PI R&D CO., LTD., MORI POLYMER CO., INC.
    Inventors: Takaki Mori, Toshiyuki Goshima, Maw Soe Win
  • Publication number: 20160360615
    Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 ?m to 3.0 ?m and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.
    Type: Application
    Filed: August 19, 2016
    Publication date: December 8, 2016
    Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., PI R&D CO., LTD.
    Inventors: Mitsuru NOZAKI, Akihiro NOMOTO, Norikatsu AKIYAMA, Eiji NAGATA, Masashi YANO
  • Patent number: 9287424
    Abstract: Disclosed are a method of forming a back reflection layer in a solar cell, a composition used therefor, and a solar cell having a back reflection layer formed by the method, which layer has superior heat-resistance and various types of durabilities, and can contribute to improving the conversion rate of solar cells and reliability during long-term use, and which method can form a back reflection layer in a solar cell easily and at low cost. The polyimide resin composition for use in forming a back reflection layer in a solar cell includes an organic solvent, a polyimide resin dissolved in the organic solvent, and light-reflecting particles dispersed in the organic solvent.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: March 15, 2016
    Assignee: PI R&D CO., LTD.
    Inventors: Maw Soe Win, Toshiyuki Goshima, Takahiro Sato, Hidenao Takato, Isao Sakata
  • Publication number: 20150249251
    Abstract: Disclosed is a highly reliable secondary battery, as well as an electrode and a conductive agent used therefor, which battery has a long cycle life and is also less likely to be damaged or rupture even when the battery temperature becomes abnormally high. The conductive agent of the battery electrode contains, as the main component, a reaction product between a ?-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by coating a composition containing this conductive agent and an electrode active substance onto a current collector. The battery comprises this electrode.
    Type: Application
    Filed: May 13, 2015
    Publication date: September 3, 2015
    Applicants: PI R&D CO., LTD., Mori Polymer Co., Inc.
    Inventors: Takaki MORI, Toshiyuki GOSHIMA, Maw Soe WIN
  • Patent number: 8987376
    Abstract: Disclosed is a polyimide composition for semiconductor devices, which has a rheological characteristics suited for screen printing and dispense coating, which has an improved wetting property with various coating bases, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a desired area. A method of forming a film in a semiconductor and semiconductors having the film formed by this method as an insulation film, protective film or the like are also disclosed. The composition for semiconductor devices contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: March 24, 2015
    Assignees: PI R&D Co., Ltd., Mitsubishi Electric Corporation
    Inventors: Toshiyuki Goshima, Sigemasa Segawa, Maw Soe Win, Junichi Yamashita, Ken Takanashi
  • Patent number: 8859170
    Abstract: Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: October 14, 2014
    Assignee: PI R&D Co., Ltd.
    Inventors: Toshiyuki Goshima, Maw Soe Win, Sigemasa Segawa, Eika Kyo
  • Patent number: 8779085
    Abstract: The present invention discloses a method of producing a modified polyimide comprising a polycarbonate, which modified polyimide has excellent electric properties and adhesion as well as excellent heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; and the modified polyimide. Also disclosed are a composition comprising the modified polyimide and used thereof.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: July 15, 2014
    Assignee: PI R&D Co., Ltd.
    Inventors: Toshiyuki Goshima, Maw Soe Win, Eika Kyo
  • Patent number: 8771496
    Abstract: A metal composite film having an excellent heat resistance and adhesion, suited for flexible printed circuit boards capable of forming fine wirings, as well as a production process thereof, is disclosed. The metal composite film comprises an insulating film; a thermoplastic polyimide layer(s) formed on at least one surface of the insulating film; and metal layers formed on the surface of each of the thermoplastic polyimide layer(s), which metal layers are formed by electroless plating and then by electrolytic plating, respectively. Since this metal composite film has an excellent heat resistance and adhesion, and maintains the excellent adhesion after forming fine wirings, it is suitably used as a high density flexible printed circuit board having fine circuits.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: July 8, 2014
    Assignee: PI R&D Co., Ltd.
    Inventors: Eiji Nagata, Hiroyuki Ishii
  • Publication number: 20130310482
    Abstract: Disclosed are a method of forming a back reflection layer in a solar cell, a composition used therefor, and a solar cell having a back reflection layer formed by the method, which layer has superior heat-resistance and various types of durabilities, and can contribute to improving the conversion rate of solar cells and reliability during long-term use, and which method can form a back reflection layer in a solar cell easily and at low cost. The polyimide resin composition for use in forming a back reflection layer in a solar cell includes an organic solvent, a polyimide resin dissolved in the organic solvent, and light-reflecting particles dispersed in the organic solvent.
    Type: Application
    Filed: September 20, 2011
    Publication date: November 21, 2013
    Applicant: PI R&D CO., LTD.
    Inventors: Maw Soe Win, Toshiyuki Goshima, Takahiro Sato, Hidenao Takato, Isao Sakata
  • Publication number: 20130233381
    Abstract: Disclosed is a polyimide resin composition for forming an insulation layer in a solar cell, which has an optimal rheological characteristics for screen printing and the like, which has an improved wetting property with various coating substrates, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a predetermined area. A method of forming an insulation layer in a solar cell and a solar cell having the insulation layer formed by this method are also disclosed.
    Type: Application
    Filed: September 20, 2011
    Publication date: September 12, 2013
    Applicant: PI R&D CO., LTD.
    Inventors: Maw Soe Win, Toshiyuki Goshima, Takahiro Sato
  • Publication number: 20130224653
    Abstract: A novel polyimide which retains the characteristics of polyimides, that is, excellent heat resistance, electrical insulation and chemical resistance, of which dielectric constant is lower than those of the known polyimides, as well as a composition containing the same and a process for producing the same, is disclosed. The polyimide of the present invention is a cross-linked polyimide having a dielectric constant of not more than 2.7, which was produced by polycondensing (a) tetramine(s), (a) tetracarboxylic dianhydride(s) and (an) aromatic diamine(s) in the presence of a catalyst.
    Type: Application
    Filed: April 3, 2013
    Publication date: August 29, 2013
    Applicant: PI R&D Co., Ltd
    Inventor: PI R&D Co., Ltd
  • Patent number: 8372257
    Abstract: A suspension type electrodeposition coating composition containing, as a resin component, block copolyimide having a siloxane bond in a molecular structure and an anionic group in a molecule. Preferably, the above-mentioned block copolyimide contains, as one of the diamine components, diamine having a siloxane, bond in a molecular structure. In addition, preferably, the above-mentioned anionic group is a carboxylic acid group or a salt thereof and/or a sulfonic acid group or a salt thereof. The electrodeposition coating composition has superior heat resistance, which does not easily develop peeling and cracks in the electrodeposited body, and is capable of efficiently forming a high-insulation electrodeposited film superior in the uniformity of film property.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: February 12, 2013
    Assignees: Mitsubishi Cable Industries, Ltd., PI R&D Co., Ltd.
    Inventors: Masanori Fujii, Toshihiro Zushi, Hiromasa Honjo, Toyokazu Nagato, Maw Soe Win, Shintaro Nakajima, Toshiyuki Goshima, Kiyoshi Ishii
  • Patent number: 8349537
    Abstract: Disclosed is a photosensitive ink which can form a coated film that is excellent in insulation properties, heat resistance, low warping, low elasticity and adhesion with the substrate, when used as an ink for screen printing, and with which clogging of the screen, bleeding, blur, chipping and the like are unlikely to occur even when the screen printing is repeatedly carried out, so that which has an excellent ease of handling in printing. The ink composition comprises 100 parts by weight of an organic solvent-soluble polyimide block copolymer(s), and 1 to 100 parts by weight of a photoacid generator(s). The polyimide block copolymer(s) and the photoacid generator(s) are dissolved in an organic solvent. The polyimide block copolymer(s) contain(s) in its molecular skeleton a diamine having a siloxane bond, and an aromatic diamine having a hydroxyl group(s) and/or carboxyl group(s) at ortho-position with respect to an amino group.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: January 8, 2013
    Assignee: PI R&D Co., Ltd.
    Inventors: Maw Soe Win, Toshiyuki Goshima, Sigemasa Segawa, Shintaro Nakajima, Eika Kyo, Yoshikazu Nishikawa, Shuzo Waki
  • Publication number: 20120189859
    Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 ?m to 3.0 ?m and a lightness value of not more than 30 on one surface of an electrolytic copper foil, and form a layer of a resin composition containing a block copolymerized polyimide resin having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.
    Type: Application
    Filed: June 25, 2010
    Publication date: July 26, 2012
    Applicants: PI R&D CO., LTD., MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Mitsuru Nozaki, Akihiro Nomoto, Norikatsu Akiyama, Eiji Nagata, Masashi Yano
  • Publication number: 20120097439
    Abstract: The present invention discloses a method of producing a modified polyimide comprising a polycarbonate, which modified polyimide has excellent electric properties and adhesion as well as excellent heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; and the modified polyimide. Also disclosed are a composition comprising the modified polyimide and used thereof.
    Type: Application
    Filed: April 30, 2010
    Publication date: April 26, 2012
    Applicant: PI R&D CO., LTD.
    Inventors: Toshiyuki Goshima, Maw Soe Win, Eika Kyo
  • Publication number: 20120097435
    Abstract: Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent.
    Type: Application
    Filed: April 30, 2010
    Publication date: April 26, 2012
    Applicant: PI R&D CO., LTD.
    Inventors: Toshiyuki Goshima, Maw Soe Win, Sigemasa Segawa, Eika Kyo