Abstract: The invention refers to a multifunctional self-sustained hosting apparatus for photonic integrated circuit and/or related chipset system packaging comprising a processed wafer (1); and at least a cavity (2), wherein said cavity (2) is configured to receive a chipset or an optical lens; and at least a V-groove (3), which is configured for receiving at least an in/out optical fiber and optically align said optical fiber with an optical endface of a chipset. The invention also refers to a bidirectional optical sub assembly based on photonic integrated circuit, which comprises said hosting apparatus. The hosting apparatus enables PIC&IC co-packaging allowing to answer current and future requirements in diverse PIC applications.

Abstract: A new and improved tunable optical receiver based on thermal optics and controllers for technologies that require fast wavelength channel tuning. The device entails a thermal control system in which a wavelength tunable filter, a sensor and at least two thermal actuators enables fast tuning, which are controlled by advanced algorithms. The key compositions of both parts are outlined and their main requirements are discussed.