Abstract: A method of manufacturing a surface-mount encapsulated reed relay comprises providing metal lead-frame having conductors for connecting the relay to a circuit and insert-moulding a plastics material plate to the lead-frame so that the conductors extend through the plate and are bonded thereto. Unwanted lead-frame parts are cut away on at least one side of the plate, leaving the conductors exposed for the connection thereto of a reed relay capsule and operating coil, whereafter a housing is fitted to the plate so as to embrace the reed relay capsule and operating coil.

Abstract: A minaturized magnetically-shielded potted electronic component such as a reed relay, is manufactured by first producing a casing by etching a u-metal sheet to produce a casing blank together with fold lines thereon, the blank then being folded to produce a casing part 10 completed by insulating plastics material end walls 21 located between turned-over end wall sections 16,17 integral with the casing side walls 12,13. The reed relay insert 24 and operating coil 25 are mounted on a lead frame 23 including pins 27,28 and then the components are positioned within the casing 10 the lead frame 23 engaging grooves 22 in the end walls 21. The space within the casing surrounding reed relay is then filled with a potting compound and the relay completed by removing the salvage bar 31 from the lead frame 23.