Patents Assigned to picoDrill SA
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Patent number: 9427885Abstract: This invention relates to methods for the production of micro-structured substrates and their application in natural sciences and technology, in particular in semiconductor, microfluidic and analysis devices. It concerns a method of introducing a structure, such as a hole or cavity or channel or well or recess or a structural change by providing a controlled electrical discharge.Type: GrantFiled: December 2, 2009Date of Patent: August 30, 2016Assignee: picoDrill SAInventors: Christian Schmidt, Leander Dittmann, Enrico Stura
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Patent number: 9114467Abstract: The present invention relates to a method of smoothing and/or bevelling an edge of a substrate. The present invention also relates to a substrate produced by the method according to the present invention, in particular a substrate having an edge smoothed and/or bevelled by the method according to the present invention.Type: GrantFiled: May 14, 2010Date of Patent: August 25, 2015Assignee: PICODRILL SAInventors: Christian Schmidt, Enrico Stura, Michael Linder
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Patent number: 8759707Abstract: This invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in analysis and detection systems based on artificial and biological lipid membranes. The structure is preferably a hole or a cavity or channel and is obtained by spark perforation. Energy, preferably heat, is applied to the region to be structured so as to reduce the amplitude of voltage required and/or soften the material. The electrical parameters of the spark perforation are feedback-controlled.Type: GrantFiled: March 30, 2005Date of Patent: June 24, 2014Assignee: Picodrill SAInventor: Christian Schmidt
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Patent number: 8736026Abstract: The present invention relates to a method of generating a hole or recess or well in an electrically insulating or semiconducting substrate, and to a hole or recess or well in a substrate generated by this method. The invention also relates to an array of holes or recesses or wells in a substrate generated by the method. The invention also relates to a device for performing the method according to the present invention.Type: GrantFiled: March 1, 2010Date of Patent: May 27, 2014Assignee: picoDrill SAInventors: Christian Schmidt, Leander Dittmann
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Patent number: 8389903Abstract: The invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in microfluidic and analysis devices and provides a method of introducing a structure, preferably a hole or cavity or channel or well or recess, in a region of an electrically insulating substrate (s), said method comprising the steps: a) providing an electrically insulating substrate (s), b) storing electrical energy across said substrate using an energy storage element (c) which is charged with said electrical energy, said energy storage element being electrically connected to said substrate, said electrical energy being sufficient to significantly heat, and/or melt and/or evaporate parts or all of a region of said substrate, c) applying additional energy, preferably heat, to said substrate or a region thereof to increase the electrical conductivity of said substrate or said region thereof, and thereby initiate a current flow and, subsequentlyType: GrantFiled: November 7, 2008Date of Patent: March 5, 2013Assignee: picoDrill SAInventor: Christian Schmidt
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Publication number: 20120181264Abstract: The present invention relates to a method of cutting a substrate by the introduction of thermo-mechanical tensions. The present invention also relates to the precise manufacturing of a substrate shape by the cutting method specified. The present invention also relates to a device for performing the method according to the present invention.Type: ApplicationFiled: September 29, 2010Publication date: July 19, 2012Applicant: picoDrill SAInventors: Enrico Stura, Christian Schmidt, Michael Linder
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Publication number: 20120138339Abstract: The present invention relates to a method of producing an electrically-conducting via in a substrate and to a substrate produced thereby. The method comprises the steps: a) providing a substrate made of at least one electrically insulating material (1), b) placing said substrate between two electrodes (3, 3?), said two electrodes being connected to a user-controlled voltage source (4), c) appling a voltage to said substrate, d) causing a dielectric breakdown and energy dissipation between said two electrodes through said substrate by locally or globally increasing the electrical conductivity of said substrate, wherein, in step d), a modification of said at least one electrically insulating material into an electrically conducting material occurs, thereby generating an electrically conducting via (6). In particular, in one embodiment, the present invention relates to a substrate, such as a printed circuit board having one or several metal-free electrically conducting vias.Type: ApplicationFiled: August 4, 2010Publication date: June 7, 2012Applicant: picoDrill SAInventor: Leander Dittmann
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Publication number: 20120055905Abstract: The present invention relates to a method of smoothing and/or bevelling an edge of a substrate. The present invention also relates to a substrate produced by the method according to the present invention, in particular a substrate having an edge smoothed and/or bevelled by the method according to the present invention.Type: ApplicationFiled: May 14, 2010Publication date: March 8, 2012Applicant: Picodrill SAInventors: Christian Schmidt, Enrico Stura, Michael Linder
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Publication number: 20110304023Abstract: The present invention relates to a method of generating a hole or recess or well in an electrically insulating or semiconducting substrate, and to a hole or recess or well in a substrate generated by this method. The invention also relates to an array of holes or recesses or wells in a substrate generated by the method. The invention also relates to a device for performing the method according to the present invention.Type: ApplicationFiled: March 1, 2010Publication date: December 15, 2011Applicant: PICODRILL SAInventors: Christian Schmidt, Leander Dittmann
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Publication number: 20110278648Abstract: This invention relates to methods for the production of micro-structured substrates and their application in natural sciences and technology, in particular in semiconductor, microfluidic and analysis devices. It concerns a method of introducing a structure, such as a hole or cavity or channel or well or recess or a structural change by providing a controlled electrical discharge.Type: ApplicationFiled: December 2, 2009Publication date: November 17, 2011Applicant: picoDrill SAInventors: Christian Schmidt, Leander Dittmann, Enrico Stura