Abstract: A receptacle assembly may include a transfer subsystem (562, 1362) to receive a pluggable module (580) and securely engage the pluggable module with an interface (564, 1364). The interface is mechanically coupled with the transfer subsystem and configured to mate with the pluggable module and to reliably transfer optical signals and/or electric signals between the pluggable module and a printed circuit board (PCB) (510, 1210, 1310) and/or another electronic or photonic circuitry coupled with the PCB. The transfer subsystem has a transfer depth of at least 12 centimeters, which is the distance between the entrance (561) of the transfer subsystem and the interface.

Abstract: A pluggable transceiver has an outer casing to be attached to a networking cable and to be plugged into a receptacle, and a bottom surface exposing a two-dimensional array of electrical contact pads. The contact pads are electrically coupled with power supplies, ground references, and data signals received from and/or transmitted to the networking cable. Parasitic properties of the electrical contact pads and any devices, circuits, tracks, or wires inside the module are sufficiently small to support data signal bandwidths exceeding 100 gigabits per second. A receptacle that can receive the pluggable transceiver module includes an EMI cage, an LGA socket, and a transfer subsystem that moves the pluggable transceiver vertically down so that the electrical contact pads are pressed into direct contact with the LGA socket.

Abstract: A vertical-cavity surface-emitting laser (VCSEL) includes a top surface with a patterned metal area that has an active bondpad and a distinct probe pad, both coupled to the VCSEL top contact. The patterned metal area is optimized to exhibit parasitic capacitance lower than 30% above a minimum achievable capacitance. The probe pad is configured for wafer-level testing, while the active bondpad is configured for subsequent bonding according to a chosen bond technology such as flip-chip bonding or hybrid bonding.

Abstract: An electrical to optical converter module has one or more fiber pigtailed or fiber connectorized electrical to optical converters; and a substrate configured to carry signals at data rates at or above 100 Gb/s. The substrate connects to the one or more fiber pigtailed or fiber connectorized electrical to optical converters, to an electrical socket that provides signals at data rates at or above 100 Gb/s, and to a DC socket module mounted on a PCB. In some cases, the substrate and the electrical socket are configured to incur signal losses lower than 1 dB/inch while carrying signals at data rates at or above 100 Gb/s.