Patents Assigned to Picosys Inc.
  • Patent number: 9440424
    Abstract: Embodiments generally relate to methods for forming and dismantling a hermetically sealed chamber. In one embodiment, the method comprises using room temperature laser bonding to create a hermetic seal between a first element and a second element to form a chamber. A bond interface of the hermetic seal is configured to allow the hermetic seal to be opened under controlled conditions using a release technique. In one embodiment, the chamber is formed within a microfluidic chip and the chamber is configured to hold a fluid. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: September 13, 2016
    Assignee: Picosys Inc
    Inventors: Raymond Miller Karam, Thomas Wynne, Anthony Thomas Chobot
  • Publication number: 20070236537
    Abstract: A print module having nozzles which are centrally disposed in a nozzle face of the module is disclosed. The arrangement of the nozzles is symmetric with respect to fluidic paths in the nozzle plates or chamber plates. The connecting channels between chambers and nozzles can also be symmetric, allowing improved performance and uniformity of drop formation, drop size and drop velocity. The module does not suffer from fluid path differences between chamber plates, uses materials similar to the completed print module without the use of bonding agents such as adhesives, and greatly improves the jetting quality by using uniform or symmetric nozzles. In addition, the print module is slim, flat, robust, and can be slanted in order to increase resolution. A variety of fluids may be dispensed by the print module, including ink. The nozzles and nozzle arrangements in the print module can be made using advanced laser structuring.
    Type: Application
    Filed: March 29, 2006
    Publication date: October 11, 2007
    Applicant: Picosys Inc.
    Inventors: Ray Karam, Georges Roussos