Abstract: The provision of a semiconductor wafer, which has been formed with a plurality of chips that each can be existent independently; the pre-cure process, in which the buffer layer has not been completely baked or hardened yet, but just for making the buffer layer be in stable condition; the pre-cut process, in which a cut is made at the position of the buffer layer corresponding to the boundary of each IC to make a gap exited between each two adjacent ICs without containing any buffer layer; the post-cut process, in which the buffer layer has completely baked and hardened; the singulation process, in which the both wafer and buffer layer are cut simultaneously to make the plural ICs separated from each other to become IC device that can act independently.