Patents Assigned to Pikington Group Limited
  • Publication number: 20140196947
    Abstract: A glazing is provided comprising at least one ply of glass having an electrically conductive component connected to an electrical connector by a soldered joint. The solder has a composition comprising tin and silver, preferably 98Sn2Ag. The solder is lead-free. The connector is nickel plated and comprises copper, preferably 99 to 99.99 wt % Cu. Samples according to the present invention did not develop cracks in the glass during temperature cycling testing.
    Type: Application
    Filed: August 15, 2012
    Publication date: July 17, 2014
    Applicant: Pikington Group Limited
    Inventor: Michael Lyon
  • Publication number: 20130056135
    Abstract: An improved process for fabrication of laminated glazings incorporating conductors such as heating elements is described. During assembly of the glazing, a solution comprising the same polymer material as the interlayer is applied to the conductors and allowed to dry prior to fitting a glazing sheet on top. This gives rise to a thin coating of polymer around the conductors and subsequent heat treatment causes the this coating and the main polymer interlayer to soften and fuse. The resulting structure shows improved encapsulation of the conductors (wires and busbars) with greater resistance to water ingress at the edge of the glazing.
    Type: Application
    Filed: March 23, 2011
    Publication date: March 7, 2013
    Applicant: Pikington Group Limited
    Inventors: Jonathan Barclay Dixon, Mark Andrew Chamberlain
  • Publication number: 20090233119
    Abstract: An improved electrical connector for use with a glazing is disclosed. The glazing preferably comprises a ply of glazing material having a first electrically conductive component mounted thereon, and a second electrically conductive component, joined to the first by a lead-free solder. The second component has a thickness t and comprises first and second connector feet linked by a bridge portion, the bridge portion being at a height h above each of the connector feet. T and/or h are chosen to minimise the occurrence of stress faults in the glass in the region of the solder. Preferably, the glazing is an automotive glazing.
    Type: Application
    Filed: March 23, 2007
    Publication date: September 17, 2009
    Applicant: Pikington Group Limited
    Inventor: Michael Lyon