Abstract: A method of assessing discrepancy between a target value and a measured value of a parameter of contact area produced between flow of solder ejected from a nozzle and a surface is defined in the present application. This method comprises the steps of: providing a surface of material through which contact area between solder ejected from a nozzle and a side of the surface can be visually detected, for example using a camera; flowing solder through a nozzle and then bringing the solder into contact with a side of the surface, thereby creating contact area between the solder and said side of the surface; detecting the contact area from the other side of the surface so that a value of a parameter of said contact area can then be measured; and assessing any discrepancy between the target value and the measured value so that any necessary compensation in order to achieve the target value can be programmed.

Abstract: A method of assessing discrepancy between a target value and a measured value of a parameter of contact area produced between flow of solder ejected from a nozzle and a surface is defined in the present application. This method comprises the steps of: providing a surface of material through which contact area between solder ejected from a nozzle and a side of the surface can be visually detected, for example using a camera; flowing solder through a nozzle and then bringing the solder into contact with a side of the surface, thereby creating contact area between the solder and said side of the surface; detecting the contact area from the other side of the surface so that a value of a parameter of said contact area can then be measured; and assessing any discrepancy between the target value and the measured value so that any necessary compensation in order to achieve the target value can be programmed.

Abstract: A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered.

Abstract: A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a second PCB work site is angularly positioned for soldering pre-loaded PCB components at a soldering station. Correct rotation of the deck is ensured by a sensor mounted on the deck. If the rotation angle is correct, locator pins provided externally of the deck become actionable by an operator to register the deck prior to the PCB being soldered.

Abstract: In a modular soldering apparatus a pump assembly (4) comprising a pump (67, 71) conduit 66 and solder nozzle (92) is removable as a unit and push contacts (42, 52?) which are broken by lifting the assembly are provided for the electrical, data and gas connections (80, 90). A solder bath (10) is also mounted on a support structure (16) and connected to data and power supplies (42) by push fit connections. The pump assembly and solder bath may be coupled together and removed as single unit.

Abstract: A selective soldering apparatus comprises a bath 3 for molten solder 5, a solder nozzle 19 and a pump 9 for pumping molten solder 5 through the nozzle 19. The nozzle has a nozzle body 21 with an inner bore 22 through which solder is pumped to overflow a nozzle outlet 33. A jacket 23 provided around the nozzle body 21 to form an enclosed space 26 open at its upper end 28 to solder which has overflowed from the nozzle outlet 33 and the cover lower end being adjacent the surface 11 of molten solder in the bath, wherein a spiral pathway 25 is provided in the enclosed space 26 so that the overflowed solder runs down the pathway into the solder bath 3. A port 39 is provided at the lower end of the jacket for gas to flow into or out of the spiral pathway so that the pathway can be purged of air when solder is not flowing through the pathway.

Abstract: In a dip soldering process, solder is pumped through a nozzle outlet. Leads of a component on a circuit board are dipped into the surface of the flowing solder to solder the leads to a track on the underside of the circuit board. To prevent solder bridging between the leads, a plate is provided below the solder surface, and passes between the leads. When withdrawing the leads from the solder, the solder surface is dropped to the level of the plate, so that excess solder is drawn away from the leads, preventing solder bridging between the leads. Member may be movable to rise through the solder surface as the circuit board is raised away from the surface.

Abstract: In a soldering process leads of components on a circuit board are dipped into a solder bath to solder them to the underside of the board. The board is rotated about a horizontal axis as it is lifted away from the bath. This reduces the tendency to form solder bridges between closely spaced leads.

Abstract: In a soldering apparatus using a rotary station, a component holder is lowered and/or moved vertically by a stepper motor drive. A motor, lowers a drive shaft by a lead screw, and a second motor rotates the shaft via a toothed bearing wheel, the shaft having a hexagonal cross-section. A pivotable lobe couples the shaft to a shaft to lower the component holder and to rotate it (by rotation of shaft). The stepper motors allow for variable speed of vertical movement of the component holder and for selective rotation.

Abstract: In a dip soldering apparatus, a first scraper blade scrapes the surface of the solder bath before a pot is raised through the surface of the bath, and a second blade then scrapes the surface of solder in the pot when the pot has been lifted through the surface. The blades are swept around in a circle to facilitate operation of the device. A rotary station for feeding components to the soldering apparatus comprises a rotatable table carrying a plurality of pneumatically operated stations to index them sequentially through operating positions. The air supply lines, for pneumatic control and operation of each station, are discrete to the respective operating positions and so it is not necessary to provide a system of supply lines which rotate with the stations. An end of a supply line is sealed to a conduit in the table by a PTFE sealing member which has an inwardly directed, tapered lip. As air pressure in the line is increased (to operate the station) the lip is urged against the underside of the table.

Abstract: In a skeining device for skeining wire fed to a coil winding apparatus, a shuttle member loops the wire around front and rear retaining members and the loops are then twisted to form the skein. The wire is under greatest tension when being pulled from the rear retaining member to the front retaining member and so the shuttle member is driven at a slower speed during this part of the skeining operation. Also, the shuttle member is reversible along its path to allow optimum positioning of the shuttle when twisting the skein and when wire passes rapidly through the device during coil winding.

Abstract: A soldering apparatus includes a solder bath 40 and a component holder 43 positioned to lower an exposed tag of a component to contact solder in the solder bath 40. After removal from the bath the component is deliberately subjected to a mechanical shock when a limb of a bracket 44 strikes a turret plate 42 under the action of a spring 46. The shock causes a short time vibration in the component and spreads solder in tears which naturally form on the exposed tags to remove or substantially reduce those tears.