Abstract: Solder is pumped through a nozzle to produce a jet of solder and leads on a printed circuit board are passed through the jet to solder them to the board tracks. The nozzle is mounted on a flange held between slip rings so that the nozzle can be rotated to change the direction of the jet. A nitrogen conduit may be provided in-line with the jet to provide a nitrogen atmosphere. A thin plate downstream of the nozzle outlet to contact the jet and inhibit sideways fluctuations when leads are passed sideways through the jet. The apparatus may also include a tube for delivering heated nitrogen gas to pre-heat a region to be soldered.