Patents Assigned to Pinch Engineering PLLC
  • BONDING OF STRUCTURES USING HIGH INTENSITY FOCUSED ULTRASOUND (HIFU)
    Publication number: 20250353092
    Abstract: Methods and systems for bonding of structures using high intensity focused ultrasound are disclosed. In one embodiment, a method for assembling components using ultrasound includes: positioning a first part of an assembly with respect to a second part of the assembly; heating a region of the assembly by focusing the ultrasound from an ultrasound transducer to the region of the assembly; and, in response to heating the region of the assembly, bonding the first part of the assembly to the second part of the assembly.
    Type: Application
    Filed: June 22, 2023
    Publication date: November 20, 2025
    Applicants: University of Washington, Pinch Engineering PLLC
    Inventors: Michael PINCH, Thomas J. MATULA, Ekaterina KUZNETSOVA, Adam D. MAXWELL, Cody BIRKLAND, Amy Jean SWANSON