Abstract: An airflow directional vane for a heatsink carrying a plurality of heat-dissipating elements which extend from a base including a vane element which is mounted directly to at least one of the heat-dissipating elements of the heatsink. The vane element extends outwardly from the heatsink to direct airflow across the heatsink through the heat-dissipating elements.

Abstract: A method of making a multiple-pin heatsink which includes forming in the upper surface of a die member a plurality of pin-receiving holes, each with a depth which is less than the length of a respective pin and forming in a base element a plurality of pin-receiving holes which correspond to the pin holes in the die member. The pins are introduced into the holes in the die member and the base element is mounted on the upper surface of the die member so that each pin extends through and above a respective hole in the base element. Sufficient downward force is applied to the upper ends of the pins to cold swage the pins into permanent attachment with the base element and the attached pins and base element are then removed from the die member.