Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, forming first and second semi-cured resin layers, stacking a first assembly of the first carrier, the first metal film, the first copper film and the first semi-cured resin layer on a second assembly of the second carrier, the second metal film, the second copper film and the second semi-cured resin layer, and vacuum hot pressing the first and second assemblies so as to complete cure and integrate the first and second semi-cured resin layers.

Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, forming first and second semi-cured resin layers, stacking a first assembly of the first carrier, the first metal film, the first copper film and the first semi-cured resin layer on a second assembly of the second carrier, the second metal film, the second copper film and the second semi-cured resin layer, and vacuum hot pressing the first and second assemblies so as to complete cure and integrate the first and second semi-cured resin layers.

Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second metal films on first and second carriers, forming first and second copper films on the first and second metal films, sandwiching a prepreg containing a curable resin body, between a first assembly of the first carrier, the first metal film and the first copper film, and a second assembly of the second carrier, the second metal film and the second copper film, and vacuum hot pressing the prepreg and the first and second assemblies so as to completely cure the curable resin body of the prepreg to form a cured resin body that is bonded to the first and second copper films of the first and second assemblies.

Abstract: A method for manufacturing a copper-clad laminate includes the steps of forming first and second copper films on first and second carriers, sandwiching a prepreg containing a curable resin body, between a first assembly of the first carrier and the first copper film, and a second assembly of the second carrier and the second copper film, and vacuum hot pressing the prepreg and the first and second assemblies so as to completely cure the curable resin body of the prepreg to form a cured resin body that is bonded to the first and second copper films of the first and second assemblies.