Abstract: The present application provides an apparatus and a method for manufacturing a semiconductor film. The apparatus includes: a chamber; a spray board arranged at a top of the chamber; a wafer pocket arranged opposite to the spray board in the chamber; and a pumping part arranged close to an inner side wall of the chamber.

Abstract: An automatic wafer carrying system and a method for transferring a wafer using the system are provided.

Abstract: This application provides a protection mechanism and a method for protecting a wafer and a pin. The protection mechanism includes: a drive; a linear unit, connected to the drive, so as to cause a pin to eject a wafer under the action of the drive; a torsion meter, configured to measure a torque of the protection mechanism in a process of ejecting the wafer by the pin; and a control module, configured to receive the torque measured by the torsion meter, and compare the torque with a predetermined value. The torsion meter is disposed between the drive and the linear unit. The to protection mechanism can effectively measure, in real time, a torque generated in a process of ejecting the wafer, and can determine, according to the torque, whether an abnormality occurs in the ejection process, so that an accident such as wafer fragmentation or pin fracturing can be effectively prevented.

Abstract: The present invention discloses a coating device including: a first shell, having a top portion and a side portion; and a second shell, accommodated in the first shell and at least partially divergently extending downwards from the top portion of the first shell. The first shell and the second shell define a first space in between, the second shell defines a second space, and the first space surrounds the second space and the two are not in communication.

Abstract: This application relates to an apparatus and method for processing a wafer. In an embodiment of this application, an apparatus for processing a wafer includes: a heater including a pedestal, where a top portion of the pedestal includes an annular edge step and a wafer pocket recessed relative to the annular edge step to accommodate a wafer; a side ring, including an outer portion and a top portion, where the outer portion surrounds an outer side wall of the pedestal, and the top portion covers an outer portion of the annular edge step and includes a centripetal slant bevel; and a shadow ring, a bottom portion thereof including a slant bevel matching the centripetal slant bevel of the top portion of the side ring.

Abstract: A wafer support pin lifting device includes a support plate, a slide block and a lifting pole. The support plate is for supporting multiple support pins. The slide block is slidably connected to an inner wall of a cavity so that the slide block slides relative to the cavity. The lifting pole has a first end, a second end and a third end. The first end is connected to the support plate, the second end is pivotally connected to the slide block, and the third end is connected to an actuator. With the pivotal connection between the second end of the lifting pole and the slide block, the lifting pole approaching the high position causes the support plate to be approximately horizontal, and the lifting pole approaching the low position causes the support plate to be tilted.

Abstract: The invention discloses a gas dispensing apparatus for multiple chemical resources, including: a showerhead assembly having at least two layers of board bodies and a gas mixing chamber defined at a center of the at least two layers of board bodies, and the gas mixing chamber having multiple holes defined thereon; and a pipeline assembly mounted to the showerhead assembly and having a stepped body defining at least two pipelines, the stepped body being configured to connect to the at least two layers of the board bodies to define at least two gas cavities, each of the gas cavities communicating with the corresponding one of the pipelines, each of the gas cavities communicating with the holes defined on the gas mixing chamber.

Abstract: The invention discloses a showerhead assembly including a male board with a top surface and a bottom surface and having an injector extending from the bottom surface to inject a first gas; and a female board with a top surface and a bottom surface and having a cavity formed on the top surface. The cavity is communicatively coupled to a gas outlet through which a second gas is guided toward to the outlet. The cavity is configured to receive the first gas from the male board such that the first gas and the second gas mix and then is exhausted via the gas outlet.

Abstract: This application relates to a semiconductor device for a condition-controlled radio frequency (RF) system. In an embodiment of this application, an RF detection apparatus includes: a high-pass filter (HPF), one end of which is electrically coupled to an RF loop electrode of a ceramic heater, and another end of which is grounded; a voltage measurer, connected to the HPF in parallel; and a low-pass circuit, connected to the HPF in parallel.

Abstract: A plate for supporting wafer has a top for carrying a wafer and a bottom coupled to a pedestal. The plate includes multiple heating units embedded within the plate and at least one set of grooves formed between the top and the bottom of the plate at a radial location between two of neighboring heating units to thereby enhance heat insulation among the heating units.